Masateru OSADA

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Mitaka-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Expanding method and expanding device
- Patent number 7,886,798
- Issue date Feb 15, 2011
- Tokyo Seimitsu Co., Ltd.
- Yuichi Kubo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Expanding method and expanding device
- Patent number 7,887,665
- Issue date Feb 15, 2011
- Tokyo Seimitsu Co., Ltd.
- Yuichi Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece cutting method for use with dicing machine
- Patent number 6,354,912
- Issue date Mar 12, 2002
- Tokyo Seimitsu Co., Ltd.
- Masateru Osada
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
EXPANDING METHOD AND EXPANDING DEVICE
- Publication number 20080105383
- Publication date May 8, 2008
- TOKYO SEIMITSU CO., LTD.
- Yuichi KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Expanding method and expanding device
- Publication number 20060005911
- Publication date Jan 12, 2006
- Yuichi Kubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die bonder
- Publication number 20040065647
- Publication date Apr 8, 2004
- TOKYO SEIMITSU CO., LTD.
- Yuichi Kubo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR