Masato Fukagaya

Follow

Person

Nagoya Aichi, JP

People

Patents Applicationslast 30 patents

Information Patent Application
Bonding wire and an integrated circuit device using the same
- Publication number 20050151253
- Publication date Jul 14, 2005
- Sumitomo Electric Wintec, Incorporated
- Tsuyoshi Nonaka
- H01 - BASIC ELECTRIC ELEMENTS