Masato KAJINAMI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for manufacturing semiconductor device and method of manu...
- Patent number 12,051,604
- Issue date Jul 30, 2024
- Samsung Electronics Co., Ltd.
- Daisuke Nagatomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting device and inspection apparatus having the same
- Patent number 11,314,073
- Issue date Apr 26, 2022
- Samsung Electronics Co., Ltd.
- Yasuhiro Hidaka
- G02 - OPTICS
Information Patent Grant
Wafer bonding method, method for manufacturing semiconductor device...
- Patent number 10,847,369
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Shinji Ueyama
- G01 - MEASURING TESTING
Information Patent Grant
Water measurement apparatus
- Patent number 10,823,682
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Takamasa Sugiura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of testing an object and apparatus for performing the same
- Patent number 10,444,162
- Issue date Oct 15, 2019
- Samsung Electronics Co., Ltd.
- Shinji Ueyama
- G01 - MEASURING TESTING
Information Patent Grant
Fluid pressure actuator
- Patent number 9,726,204
- Issue date Aug 8, 2017
- Samsung Electronics Co., Ltd.
- Masato Kajinami
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Grant
Semiconductor manufacturing apparatuses comprising bonding heads
- Patent number 9,508,577
- Issue date Nov 29, 2016
- Samsung Electronics Co., Ltd.
- Byung Joon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recognition apparatus, recognition method, mounting apparatus, and...
- Patent number 9,319,593
- Issue date Apr 19, 2016
- Samsung Electronics Co., Ltd.
- Ueyama Shinji
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus and method of recognizing an object, and apparatus and me...
- Patent number 9,218,654
- Issue date Dec 22, 2015
- Samsung Electronics Co., Ltd.
- Ueyama Shinji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus and mounting method for flip chip bonding semico...
- Patent number 9,209,051
- Issue date Dec 8, 2015
- Samsung Electronics Co., Ltd.
- Yukimori Yoshiaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip bonding apparatus and method of forming semicond...
- Patent number 9,082,885
- Issue date Jul 14, 2015
- Samsung Electronics Co., Ltd.
- Yoshiaki Yukimori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL DEVICE AND OPTICAL MEASUREMENT METHOD
- Publication number 20240183657
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Daisuke NAGATOMO
- G01 - MEASURING TESTING
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20240186278
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Masato KAJINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PEELING APARATUS AND CHIP PEELING METHOD
- Publication number 20230369078
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Tatsuya ISHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230187249
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Daisuke NAGATOMO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PEELING APPARATUS AND CHIP PEELING METHOD USING THE SAME
- Publication number 20230178394
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Tatsuya ISHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANU...
- Publication number 20220216077
- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Daisuke Nagatomo
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
WAFER BONDING APPARATUS
- Publication number 20220157633
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Masato KAJINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND CHIP HANDLING METHOD
- Publication number 20220139755
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Naoyuki TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WATER MEASUREMENT APPARATUS
- Publication number 20200217805
- Publication date Jul 9, 2020
- Samsung Electronics Co., Ltd.
- Takamasa SUGIURA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER BONDING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20200209164
- Publication date Jul 2, 2020
- Samsung Electronics Co., Ltd.
- Shinji UEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING DEVICE AND INSPECTION APPARATUS HAVING THE SAME
- Publication number 20200132977
- Publication date Apr 30, 2020
- Samsung Electronics Co., Ltd.
- YASUHIRO HIDAKA
- G02 - OPTICS
Information Patent Application
METHOD OF TESTING AN OBJECT AND APPARATUS FOR PERFORMING THE SAME
- Publication number 20180284032
- Publication date Oct 4, 2018
- Samsung Electronics Co., Ltd.
- SHINJI UEYAMA
- G01 - MEASURING TESTING
Information Patent Application
FLUID PRESSURE ACTUATOR
- Publication number 20150159681
- Publication date Jun 11, 2015
- Samsung Electronics Co., Ltd.
- Masato KAJINAMI
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUSES AND METHODS THEREOF
- Publication number 20150155210
- Publication date Jun 4, 2015
- Samsung Electronics Co., Ltd.
- Byung Joon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...
- Publication number 20150024551
- Publication date Jan 22, 2015
- Samsung Electronics Co., Ltd.
- Yoshiaki YUKIMORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOGNITION APPARATUS, RECOGNITION METHOD, MOUNTING APPARATUS, AND...
- Publication number 20140160272
- Publication date Jun 12, 2014
- Samsung Electronics Co., Ltd.
- Ueyama SHINJI
- G01 - MEASURING TESTING
Information Patent Application
MOUNTING APPARATUS AND MOUNTING METHOD
- Publication number 20140154838
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Yukimori YOSHIAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD OF RECOGNIZING AN OBJECT, AND APPARATUS AND ME...
- Publication number 20140141539
- Publication date May 22, 2014
- Samsung Electronics Co., Ltd.
- Ueyama SHINJI
- G01 - MEASURING TESTING

Masato KAJINAMI

Person

Patents Grantslast 30 patents

Apparatus for manufacturing semiconductor device and method of manu...

Lighting device and inspection apparatus having the same

Wafer bonding method, method for manufacturing semiconductor device...

Water measurement apparatus

Method of testing an object and apparatus for performing the same

Fluid pressure actuator

Semiconductor manufacturing apparatuses comprising bonding heads

Recognition apparatus, recognition method, mounting apparatus, and...

Apparatus and method of recognizing an object, and apparatus and me...

Mounting apparatus and mounting method for flip chip bonding semico...

Semiconductor chip bonding apparatus and method of forming semicond...

Patents Applicationslast 30 patents

OPTICAL DEVICE AND OPTICAL MEASUREMENT METHOD

MOUNTING DEVICE AND MOUNTING METHOD

CHIP PEELING APARATUS AND CHIP PEELING METHOD

MOUNTING DEVICE AND MOUNTING METHOD

CHIP PEELING APPARATUS AND CHIP PEELING METHOD USING THE SAME

APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANU...

WAFER BONDING APPARATUS

SEMICONDUCTOR MANUFACTURING APPARATUS AND CHIP HANDLING METHOD

WATER MEASUREMENT APPARATUS

WAFER BONDING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

LIGHTING DEVICE AND INSPECTION APPARATUS HAVING THE SAME

METHOD OF TESTING AN OBJECT AND APPARATUS FOR PERFORMING THE SAME

FLUID PRESSURE ACTUATOR

SEMICONDUCTOR MANUFACTURING APPARATUSES AND METHODS THEREOF

SEMICONDUCTOR CHIP BONDING APPARATUS AND METHOD OF FORMING SEMICOND...

RECOGNITION APPARATUS, RECOGNITION METHOD, MOUNTING APPARATUS, AND...

MOUNTING APPARATUS AND MOUNTING METHOD

APPARATUS AND METHOD OF RECOGNIZING AN OBJECT, AND APPARATUS AND ME...