Masato KINOUCHI

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Machining device, machining unit, and machining method
- Patent number 11,548,097
- Issue date Jan 10, 2023
- Mitsubishi Heavy Industries, Ltd.
- Saneyuki Goya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing method and laser processing apparatus
- Patent number 10,792,759
- Issue date Oct 6, 2020
- Mitsubishi Heavy Industries, Ltd.
- Saneyuki Goya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing apparatus and processing method
- Patent number 9,862,055
- Issue date Jan 9, 2018
- Mitsubishi Heavy Industries, Ltd.
- Saneyuki Goya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature bonding apparatus and room temperature bonding method
- Patent number 9,580,306
- Issue date Feb 28, 2017
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room-temperature bonding apparatus
- Patent number 9,443,711
- Issue date Sep 13, 2016
- Mitsubishi Heavy Industries Machine Tool Co., Ltd.
- Masato Kinouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding device and wafer bonding method
- Patent number 9,130,000
- Issue date Sep 8, 2015
- Mitsubishi Heavy Industries
- Takeshi Tsuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding unit control unit and multi-layer bonding method
- Patent number 9,064,910
- Issue date Jun 23, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding unit control unit and multi-layer bonding method
- Patent number 9,023,170
- Issue date May 5, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Room temperature bonding apparatus
- Patent number 9,005,390
- Issue date Apr 14, 2015
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature bonding machine and room temperature bonding method
- Patent number 8,985,175
- Issue date Mar 24, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature bonding apparatus
- Patent number 8,906,175
- Issue date Dec 9, 2014
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature bonding apparatus
- Patent number 8,857,487
- Issue date Oct 14, 2014
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20170162428
- Publication date Jun 8, 2017
- MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
- Masato KINOUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
- Publication number 20160193693
- Publication date Jul 7, 2016
- Mitsubishi Heavy Industries, Ltd.
- Saneyuki GOYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20160008920
- Publication date Jan 14, 2016
- Mitsubishi Heavy Industries, Ltd.
- Saneyuki GOYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM-TEMPERATURE BONDED DEVICE, WAFER HAVING ROOM-TEMPERATURE BONDE...
- Publication number 20150294900
- Publication date Oct 15, 2015
- Mitsubishi Heavy Industries, Ltd.
- Takayuki Goto
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD
- Publication number 20150251904
- Publication date Sep 10, 2015
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM-TEMPERATURE BONDING APPARATUS AND ROOM-TEMPERATURE BONDING METHOD
- Publication number 20150249026
- Publication date Sep 3, 2015
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MACHINING DEVICE, MACHINING UNIT, AND MACHINING METHOD
- Publication number 20150014889
- Publication date Jan 15, 2015
- Mitsubishi Heavy Industries, Ltd.
- Saneyuki Goya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM-TEMPERATURE BONDING APPARATUS
- Publication number 20140224405
- Publication date Aug 14, 2014
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD
- Publication number 20130112334
- Publication date May 9, 2013
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- B32 - LAYERED PRODUCTS
Information Patent Application
Room Temperature Bonding Apparatus
- Publication number 20120285624
- Publication date Nov 15, 2012
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM
- Publication number 20120247645
- Publication date Oct 4, 2012
- MITSUBISHI HEAVY INDUSTIRIES, LTD.
- Keiichiro Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING UNIT CONTROL UNIT AND MULTI-LAYER BONDING METHOD
- Publication number 20120031557
- Publication date Feb 9, 2012
- Mitsubishi Heavy Industries, Ltd.,
- Masato Kinouchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS
- Publication number 20110277904
- Publication date Nov 17, 2011
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER BONDING DEVICE AND WAFER BONDING METHOD
- Publication number 20110207291
- Publication date Aug 25, 2011
- Mitsubishi Heavy Industries, Ltd.,
- Takeshi Tsuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE BONDING MACHINE AND ROOM TEMPERATURE BONDING METHOD
- Publication number 20110083801
- Publication date Apr 14, 2011
- Mitsubishi Heavy Industries, Ltd.
- Masato Kinouchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROOM TEMPERATURE BONDING APPARATUS
- Publication number 20110011536
- Publication date Jan 20, 2011
- Takeshi Tsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MICROSTRUCTURE AND MANUFACTURING SYSTEM FOR...
- Publication number 20070256774
- Publication date Nov 8, 2007
- Takeshi Tsuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of manufacturing microstructure and manufacturing system for...
- Publication number 20050233064
- Publication date Oct 20, 2005
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Manufacturing system for microstructure
- Publication number 20050229737
- Publication date Oct 20, 2005
- Mitsubishi Heavy Industries, Ltd.
- Takeshi Tsuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Masato KINOUCHI

Person

Patents Grantslast 30 patents

Machining device, machining unit, and machining method

Laser processing method and laser processing apparatus

Processing apparatus and processing method

Room temperature bonding apparatus and room temperature bonding method

Room-temperature bonding apparatus

Wafer bonding device and wafer bonding method

Bonding unit control unit and multi-layer bonding method

Bonding unit control unit and multi-layer bonding method

Room temperature bonding apparatus

Room temperature bonding machine and room temperature bonding method

Room temperature bonding apparatus

Room temperature bonding apparatus

Patents Applicationslast 30 patents

ROOM-TEMPERATURE BONDING APPARATUS

LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS

PROCESSING APPARATUS AND PROCESSING METHOD

ROOM-TEMPERATURE BONDED DEVICE, WAFER HAVING ROOM-TEMPERATURE BONDE...

ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD

ROOM-TEMPERATURE BONDING APPARATUS AND ROOM-TEMPERATURE BONDING METHOD

MACHINING DEVICE, MACHINING UNIT, AND MACHINING METHOD

ROOM-TEMPERATURE BONDING APPARATUS

ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD

Room Temperature Bonding Apparatus

BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM

BONDING UNIT CONTROL UNIT AND MULTI-LAYER BONDING METHOD

ROOM TEMPERATURE BONDING APPARATUS

WAFER BONDING DEVICE AND WAFER BONDING METHOD

ROOM TEMPERATURE BONDING MACHINE AND ROOM TEMPERATURE BONDING METHOD

ROOM TEMPERATURE BONDING APPARATUS

METHOD OF MANUFACTURING MICROSTRUCTURE AND MANUFACTURING SYSTEM FOR...

Method of manufacturing microstructure and manufacturing system for...

Manufacturing system for microstructure