Masato Maeda

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Package board and semiconductor device
- Patent number 7,474,006
- Issue date Jan 6, 2009
- NEC Electronics Corporation
- Masato Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method and bonding apparatus
- Patent number 7,370,786
- Issue date May 13, 2008
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method and bonding apparatus
- Patent number 6,932,262
- Issue date Aug 23, 2005
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Cell Search Control Method and Mobile Device Using the Method
- Publication number 20080057959
- Publication date Mar 6, 2008
- Takehiro Ida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Package board and semiconductor device
- Publication number 20070075438
- Publication date Apr 5, 2007
- Masato Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method and bonding apparatus
- Publication number 20060011706
- Publication date Jan 19, 2006
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding method and bonding apparatus
- Publication number 20040214406
- Publication date Oct 28, 2004
- NEC Electronics Corporation
- Yoichiro Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR