Masato Sasaki

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Resin-sealed semiconductor device, circuit member used therefor
- Patent number 6,201,292
- Issue date Mar 13, 2001
- Dai Nippon Insatsu Kabushiki Kaisha
- Hiroshi Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit member for semiconductor device, semiconductor device using...
- Patent number 6,133,070
- Issue date Oct 17, 2000
- Dai Nippon Printing Co., Ltd.
- Hiroshi Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-sealed semiconductor device, circuit member for use therein a...
- Patent number 6,025,640
- Issue date Feb 15, 2000
- Dai Nippon Insatsu Kabushiki Kaisha
- Hiroshi Yagi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INFORMATION PROCESSING APPARATUS, INFORMATION PROCESSING METHOD, AN...
- Publication number 20250047973
- Publication date Feb 6, 2025
- NEC CORPORATION
- Ryo YAMAKABE
- G06 - COMPUTING CALCULATING COUNTING