Masato Tanaka

Person

Nakano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,591,750
- Issue date Mar 7, 2017
- Shinko Electric Industries Co., Ltd.
- Masato Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,257,386
- Issue date Feb 9, 2016
- Shinko Electric Industries Co., Ltd.
- Hiromu Arisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, semiconductor device, and method of manufacturing...
- Patent number 9,220,167
- Issue date Dec 22, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,148,952
- Issue date Sep 29, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
- Patent number 9,142,524
- Issue date Sep 22, 2015
- Shinko Electric Industries Co., Ltd.
- Masahiro Kyozuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device, and method for manufac...
- Patent number 9,054,082
- Issue date Jun 9, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,000,302
- Issue date Apr 7, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package including a metal plate, semiconductor chip,...
- Patent number 8,994,193
- Issue date Mar 31, 2015
- Shinko Electric Industries Co., Ltd.
- Akihiko Tateiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and its manufacture method
- Patent number 8,791,561
- Issue date Jul 29, 2014
- Fujitsu Limited
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket and method of fabricating the same
- Patent number 8,419,442
- Issue date Apr 16, 2013
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and its manufacture method
- Patent number 8,399,295
- Issue date Mar 19, 2013
- Fujitsu Limited
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket and semiconductor device including socket and semiconductor...
- Patent number 8,272,880
- Issue date Sep 25, 2012
- Shinko Electric Industries Co., Ltd.
- Masato Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer interconnection board and production method thereof
- Patent number 7,183,196
- Issue date Feb 27, 2007
- Shinko Electric Industries Co., Ltd.
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer lead frame using a metal-core substrate
- Patent number 5,389,816
- Issue date Feb 14, 1995
- Shinko Electric Industries Co., Ltd.
- Mitsuharu Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame used therein
- Patent number 5,293,301
- Issue date Mar 8, 1994
- Shinko Electric Industries Co., Ltd.
- Masato Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wiring Substrate, Semiconductor Device, and Method of Manufacturing...
- Publication number 20150245473
- Publication date Aug 27, 2015
- Shinko Electric Industries Co., LTD.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20150181703
- Publication date Jun 25, 2015
- Shinko Electric Industries Co., LTD.
- Masato TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20150179560
- Publication date Jun 25, 2015
- Shinko Electric Industries Co., LTD.
- Hiromu Arisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20150163899
- Publication date Jun 11, 2015
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140311771
- Publication date Oct 23, 2014
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...
- Publication number 20130328211
- Publication date Dec 12, 2013
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUF...
- Publication number 20130249075
- Publication date Sep 26, 2013
- Shinko Electric Industries Co., Ltd.
- Akihiko Tateiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD
- Publication number 20130154102
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20120187557
- Publication date Jul 26, 2012
- Shinko Electric Industries Co., Ltd.
- Masahiro KYOZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET AND METHOD OF FABRICATING THE SAME
- Publication number 20120021625
- Publication date Jan 26, 2012
- Shinko Electric Industries Co., Ltd.
- Yasuyoshi Horikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOCKET AND SEMICONDUCTOR DEVICE INCLUDING SOCKET AND SEMICONDUCTOR...
- Publication number 20110207346
- Publication date Aug 25, 2011
- Shinko Electric Industries Co., Ltd.
- Masato Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD
- Publication number 20110187002
- Publication date Aug 4, 2011
- FUJITSU LIMITED
- Sadahiro Kishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD...
- Publication number 20110010932
- Publication date Jan 20, 2011
- Shinko Electric Industries Co., Ltd.
- Masato TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD...
- Publication number 20090135574
- Publication date May 28, 2009
- Shinko Electric Industries Co., Ltd.
- Masato TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXTERNAL CONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE, AND METHOD...
- Publication number 20070126108
- Publication date Jun 7, 2007
- Shinko Electric Industries Co., Ltd.
- Katsumi Yamazaki
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer interconnection board and production method thereof
- Publication number 20050146038
- Publication date Jul 7, 2005
- Shigetsugu Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Masato Tanaka

Person

Patents Grantslast 30 patents

Wiring substrate and semiconductor device

Wiring substrate and semiconductor device

Wiring substrate, semiconductor device, and method of manufacturing...

Wiring board

Semiconductor package and method for manufacturing semiconductor pa...

Semiconductor package, semiconductor device, and method for manufac...

Wiring board

Semiconductor package including a metal plate, semiconductor chip,...

Semiconductor device and its manufacture method

Socket and method of fabricating the same

Semiconductor device and its manufacture method

Socket and semiconductor device including socket and semiconductor...

Multilayer interconnection board and production method thereof

Multi-layer lead frame using a metal-core substrate

Semiconductor device and lead frame used therein

Patents Applicationslast 30 patents

Wiring Substrate, Semiconductor Device, and Method of Manufacturing...

Wiring Substrate and Semiconductor Device

Wiring Substrate and Semiconductor Device

WIRING BOARD

WIRING BOARD

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFAC...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR APPARATUS AND METHOD FOR MANUF...

SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PA...

SOCKET AND METHOD OF FABRICATING THE SAME

SOCKET AND SEMICONDUCTOR DEVICE INCLUDING SOCKET AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND ITS MANUFACTURE METHOD

WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD...

WIRING BOARD, SEMICONDUCTOR DEVICE HAVING WIRING BOARD, AND METHOD...

EXTERNAL CONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE, AND METHOD...

Multilayer interconnection board and production method thereof