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Fuji, JP
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last 30 patents
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Patent Grant
Sealing resin composition for electronic component and electronic c...
Patent number
5,110,861
Issue date
May 5, 1992
Polyplastics Co., Ltd.
Masato Togami
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Improvements in the encapsulation of electronic components employin...
Patent number
5,091,135
Issue date
Feb 25, 1992
Polyplastic Co., Ltd.
Tsuneyoshi Okada
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...