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Masato Tsuchiya
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Core material, electronic component and method for forming bump ele...
Patent number
11,872,656
Issue date
Jan 16, 2024
Senju Metal Industry Co., Ltd.
Shigeki Kondoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Layered bonding material, semiconductor package, and power module
Patent number
11,712,760
Issue date
Aug 1, 2023
Senju Metal Industry Co., Ltd.
Naoto Kameda
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Core material, electronic component and method for forming bump ele...
Patent number
11,495,566
Issue date
Nov 8, 2022
Senju Metal Industry Co., Ltd.
Shigeki Kondoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cu core ball, solder joint, solder paste and formed solder
Patent number
10,888,959
Issue date
Jan 12, 2021
Senju Metal Industry Co., Ltd.
Hiroyoshi Kawasaki
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Cu core ball, solder joint, solder paste and formed solder
Patent number
10,639,749
Issue date
May 5, 2020
Senju Metal Industry Co., Ltd.
Hiroyoshi Kawasaki
B22 - CASTING POWDER METALLURGY
Patents Applications
last 30 patents
Information
Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
Publication number
20240100635
Publication date
Mar 28, 2024
SENJU METAL INDUSTRY CO., LTD.
Shigeki Kondoh
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Metal Body, Fitting Connection Terminal, and Method for Forming Met...
Publication number
20230094946
Publication date
Mar 30, 2023
SENJU METAL INDUSTRY CO., LTD.
Hiroyuki Iwamoto
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE
Publication number
20230039027
Publication date
Feb 9, 2023
SENJU METAL INDUSTRY CO., LTD.
Naoto KAMEDA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
Publication number
20220212294
Publication date
Jul 7, 2022
SENJU METAL INDUSTRY CO., LTD.
Shigeki KONDOH
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CORE MATERIAL, ELECTRONIC COMPONENT AND METHOD FOR FORMING BUMP ELE...
Publication number
20220077093
Publication date
Mar 10, 2022
SENJU METAL INDUSTRY CO., LTD.
Shigeki KONDOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
Publication number
20190375054
Publication date
Dec 12, 2019
SENJU METAL INDUSTRY CO., LTD.
Hiroyoshi Kawasaki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
Publication number
20190376161
Publication date
Dec 12, 2019
SENJU METAL INDUSTRY CO., LTD.
Hiroyoshi Kawasaki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Cu Core Ball, Solder Joint, Solder Paste and Formed Solder
Publication number
20190375053
Publication date
Dec 12, 2019
SENJU METAL INDUSTRY CO., LTD.
Hiroyoshi Kawasaki
B22 - CASTING POWDER METALLURGY
Information
Patent Application
Mobile Communication System and Method Of Handover To Small Radio B...
Publication number
20070202866
Publication date
Aug 30, 2007
Masato Tsuchiya
H04 - ELECTRIC COMMUNICATION TECHNIQUE