Masatoshi Inaba

Person

Koto-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate
- Patent number 11,638,351
- Issue date Apr 25, 2023
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board and printed circuit b...
- Patent number 9,006,579
- Issue date Apr 14, 2015
- Fujikura Ltd.
- Masatoshi Inaba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 8,282,841
- Issue date Oct 9, 2012
- Fujikura Ltd.
- Kanako Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 7,476,812
- Issue date Jan 13, 2009
- Fujikura Ltd.
- Kanako Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a semiconductor package, with a rerouted elect...
- Patent number 7,157,363
- Issue date Jan 2, 2007
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device and electronic device
- Patent number 7,023,088
- Issue date Apr 4, 2006
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device, electronic device, and...
- Patent number 6,835,595
- Issue date Dec 28, 2004
- Fujikura Ltd.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device, electronic device and...
- Patent number 6,387,734
- Issue date May 14, 2002
- Fujikura Ltd.
- Masatoshi Inaba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20230232532
- Publication date Jul 20, 2023
- FUJIKURA LTD.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20210195741
- Publication date Jun 24, 2021
- FUJIKURA LTD.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT B...
- Publication number 20130087370
- Publication date Apr 11, 2013
- FUJIKURA LTD.
- Masatoshi INABA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080185362
- Publication date Aug 7, 2008
- FUJIKURA LTD.
- Kanako Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and manufacturing method thereof
- Publication number 20070049060
- Publication date Mar 1, 2007
- FUJIKURA LTD.
- Kanako Nakajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package, semiconductor device, electronic device, and...
- Publication number 20050037539
- Publication date Feb 17, 2005
- FUJIKURA LTD.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package, semiconductor device, electronic device, and...
- Publication number 20030207494
- Publication date Nov 6, 2003
- FUJIKURA LTD.
- Takanao Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Masatoshi Inaba

Person

Patents Grantslast 30 patents

Component-embedded substrate

Component-embedded substrate

Method of manufacturing printed circuit board and printed circuit b...

Printed circuit board and manufacturing method thereof

Printed circuit board and manufacturing method thereof

Method for producing a semiconductor package, with a rerouted elect...

Semiconductor package, semiconductor device and electronic device

Semiconductor package, semiconductor device, electronic device, and...

Semiconductor package, semiconductor device, electronic device and...

Patents Applicationslast 30 patents

COMPONENT-EMBEDDED SUBSTRATE

COMPONENT-EMBEDDED SUBSTRATE

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT B...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Printed circuit board and manufacturing method thereof

Semiconductor package, semiconductor device, electronic device, and...

Semiconductor package, semiconductor device, electronic device, and...