Masatoshi Nakamura

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Nagano-shi, Nagano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip mounting substrate and flip-chip mounting method
- Patent number 8,669,665
- Issue date Mar 11, 2014
- Shinko Electric Industries Co., Ltd.
- Yasushi Araki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,901,997
- Issue date Mar 8, 2011
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mounting substrate
- Patent number 7,884,482
- Issue date Feb 8, 2011
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mounting substrate and flip-chip mounting method
- Patent number 7,847,417
- Issue date Dec 7, 2010
- Shinko Electric Industries Co., Ltd.
- Yasushi Araki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting substrate and semiconductor device
- Patent number 7,838,998
- Issue date Nov 23, 2010
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP MOUNTING SUBSTRATE AND FLIP-CHIP MOUNTING METHOD
- Publication number 20090250812
- Publication date Oct 8, 2009
- Shinko Electric Industries Co., Ltd.
- Yasushi Araki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20080188040
- Publication date Aug 7, 2008
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP-CHIP MOUNTING SUBSTRATE
- Publication number 20080142993
- Publication date Jun 19, 2008
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP-CHIP MOUNTING SUBSTRATE AND FLIP-CHIP MOUNTING METHOD
- Publication number 20070145553
- Publication date Jun 28, 2007
- Shinko Electric Industries Co., Ltd.
- Yasushi Araki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20070108628
- Publication date May 17, 2007
- Shinko Electric Industries Co., Ltd.
- Takashi Ozawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...