Masatoshi Suehiro

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Via-filling conductive paste composition
- Patent number 6,080,336
- Issue date Jun 27, 2000
- Kyoto Elex Co., Ltd.
- Masatoshi Suehiro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,977,490
- Issue date Nov 2, 1999
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,914,358
- Issue date Jun 22, 1999
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,733,467
- Issue date Mar 31, 1998
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste compound for via hole filling, printed circuit boa...
- Patent number 5,652,042
- Issue date Jul 29, 1997
- Matsushita Electric Industrial Co., Ltd.
- Kouji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper paste composition
- Patent number 5,035,837
- Issue date Jul 30, 1991
- Dia-Ichi Kogyo Seiyaku Co., Ltd.
- Shuji Saeki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper conductor composition
- Patent number 4,937,016
- Issue date Jun 26, 1990
- Dai-Ichi Kogyo Seiyaku Co., Ltd.
- Masatoshi Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper conductor composition
- Patent number 4,906,404
- Issue date Mar 6, 1990
- Dai-Ichi Kogyo Seiyaku Co., Ltd.
- Masatoshi Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper thick film conductor composition
- Patent number 4,865,772
- Issue date Sep 12, 1989
- Masatoshi Suehiro
- H01 - BASIC ELECTRIC ELEMENTS

Masatoshi Suehiro

Person

Patents Grantslast 30 patents

Via-filling conductive paste composition

Conductive paste compound for via hole filling, printed circuit boa...

Conductive paste compound for via hole filling, printed circuit boa...

Conductive paste compound for via hole filling, printed circuit boa...

Conductive paste compound for via hole filling, printed circuit boa...

Copper paste composition

Copper conductor composition

Copper conductor composition

Copper thick film conductor composition