Masatoshi Tanabe

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 11,610,860
- Issue date Mar 21, 2023
- Kabushiki Kaisha Toshiba
- Masatoshi Tanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding apparatus, control device and control method
- Patent number 11,370,180
- Issue date Jun 28, 2022
- Kabushiki Kaisha Toshiba
- Takahiro Aizawa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Ultrasonic bonding apparatus
- Patent number 11,292,211
- Issue date Apr 5, 2022
- Kabushiki Kaisha Toshiba
- Takashi Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,811,391
- Issue date Oct 20, 2020
- Kabushiki Kaisha Toshiba
- Akira Tojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,438,935
- Issue date Oct 8, 2019
- TOSHIBA MEMORY CORPORATION
- Kazuo Shimokawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRASONIC BONDING APPARATUS
- Publication number 20220105692
- Publication date Apr 7, 2022
- Kabushiki Kaisha Toshiba
- Takashi ITO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ULTRASONIC BONDING APPARATUS, CONTROL DEVICE AND CONTROL METHOD
- Publication number 20220105693
- Publication date Apr 7, 2022
- Kabushiki Kaisha Toshiba
- Takahiro AIZAWA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BUNDLING METHOD, MANUFACTURING METHOD OF BATTERY, AND BUNDLING APPA...
- Publication number 20210280841
- Publication date Sep 9, 2021
- Kabushiki Kaisha Toshiba
- Takahiro AIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE GROUP AND BATTERY
- Publication number 20210280840
- Publication date Sep 9, 2021
- Kabushiki Kaisha Toshiba
- Masatoshi TANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20210091038
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Masatoshi Tanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190287945
- Publication date Sep 19, 2019
- KABUSHIKI KAISHA TOSHIBA
- Akira TOJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190287952
- Publication date Sep 19, 2019
- Toshiba Memory Corporation
- Kazuo SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Masatoshi Tanabe

Person

Patents Grantslast 30 patents

Wire bonding apparatus and wire bonding method

Ultrasonic bonding apparatus, control device and control method

Ultrasonic bonding apparatus

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Patents Applicationslast 30 patents

ULTRASONIC BONDING APPARATUS

ULTRASONIC BONDING APPARATUS, CONTROL DEVICE AND CONTROL METHOD

BUNDLING METHOD, MANUFACTURING METHOD OF BATTERY, AND BUNDLING APPA...

ELECTRODE GROUP AND BATTERY

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE