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Masatoshi Wakahara

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer processing method
    • Patent number 10,991,622
    • Issue date Apr 27, 2021
    • DISCO CORPORTION
    • Meiyu Piao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,991,623
    • Issue date Apr 27, 2021
    • Disco Corporation
    • Masatoshi Wakahara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor wafer processing method
    • Patent number 10,796,962
    • Issue date Oct 6, 2020
    • Disco Corporation
    • Masatoshi Wakahara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 10,784,166
    • Issue date Sep 22, 2020
    • Disco Corporation
    • Meiyu Piao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device manufacturing method
    • Patent number 7,888,239
    • Issue date Feb 15, 2011
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    DEVICE WAFER PROCESSING METHOD
    • Publication number 20240105458
    • Publication date Mar 28, 2024
    • Disco Corporation
    • Masatoshi WAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20230260854
    • Publication date Aug 17, 2023
    • Disco Corporation
    • Masatoshi WAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING CHIPS
    • Publication number 20230005792
    • Publication date Jan 5, 2023
    • Disco Corporation
    • Masatoshi WAKAHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PLASMA ETCHING APPARATUS
    • Publication number 20210043474
    • Publication date Feb 11, 2021
    • Disco Corporation
    • Masatoshi WAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200185227
    • Publication date Jun 11, 2020
    • Disco Corporation
    • Masatoshi WAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200051861
    • Publication date Feb 13, 2020
    • Disco Corporation
    • Meiyu PIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20200051862
    • Publication date Feb 13, 2020
    • Disco Corporation
    • Meiyu PIAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR WAFER PROCESSING METHOD
    • Publication number 20200020585
    • Publication date Jan 16, 2020
    • Disco Corporation
    • Masatoshi WAKAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    • Publication number 20100015784
    • Publication date Jan 21, 2010
    • Disco Corporation
    • Masaru Nakamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor wafer processing method
    • Publication number 20040161940
    • Publication date Aug 19, 2004
    • Toshiharu Daii
    • H01 - BASIC ELECTRIC ELEMENTS