Masatoshi Yasunaga

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,050,011
- Issue date Aug 14, 2018
- Renesas Electronics Corporation
- Kenya Hironaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,589,923
- Issue date Mar 7, 2017
- Renesas Electronics Corporation
- Kenya Hironaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,130,062
- Issue date Sep 8, 2015
- Renesas Electronics Corporation
- Kenya Hironaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,087,816
- Issue date Jul 21, 2015
- Renesas Electronics Corporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,024,454
- Issue date May 5, 2015
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wire having different width portions
- Patent number 8,772,952
- Issue date Jul 8, 2014
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,692,383
- Issue date Apr 8, 2014
- Renesas Electronics Coporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,629,002
- Issue date Jan 14, 2014
- Renesas Electronics Corporation
- Soshi Kuroda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of inspecting semiconductor device
- Patent number 8,605,277
- Issue date Dec 10, 2013
- Renesas Electronics Corporation
- Satoshi Yamada
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,334,172
- Issue date Dec 18, 2012
- Renesas Electronics Corporation
- Soshi Kuroda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,293,575
- Issue date Oct 23, 2012
- Renesas Electronics Corporation
- Tatsuya Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an improved mounting structure
- Patent number 6,856,028
- Issue date Feb 15, 2005
- Renesas Technology Corp.
- Kazuyuki Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device constituting a CMOS camera system
- Patent number 6,768,516
- Issue date Jul 27, 2004
- Renesas Technology Corp.
- Satoshi Yamada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing a packaged semiconductor device, and a semi...
- Patent number 6,544,814
- Issue date Apr 8, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,476,502
- Issue date Nov 5, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Satoshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,469,395
- Issue date Oct 22, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Tatsuto Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,462,425
- Issue date Oct 8, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Toshihiro Iwasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 6,256,875
- Issue date Jul 10, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package and manufacturing method of the same
- Patent number 6,191,493
- Issue date Feb 20, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for semiconductor device laminated printed circuit boards
- Patent number 6,005,289
- Issue date Dec 21, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package and manufacturing method of the same
- Patent number 5,920,770
- Issue date Jul 6, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package
- Patent number 5,753,973
- Issue date May 19, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin seal semiconductor package
- Patent number 5,656,863
- Issue date Aug 12, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared radiation detector
- Patent number 5,296,710
- Issue date Mar 22, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Katsuhiro Ohno
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating semiconductor device having sidewall spacers...
- Patent number 5,217,910
- Issue date Jun 8, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Masahiro Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a resin encapsulated semiconductor device
- Patent number 5,096,853
- Issue date Mar 17, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufactured by using conductive ion implantat...
- Patent number 5,075,240
- Issue date Dec 24, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Yomiyuki Yama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor device
- Patent number 5,018,003
- Issue date May 21, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170162539
- Publication date Jun 8, 2017
- RENESAS ELECTRONICS CORPORATION
- Kenya HIRONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150371967
- Publication date Dec 24, 2015
- RENESAS ELECTRONICS CORPORATION
- Kenya HIRONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140273353
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20140175678
- Publication date Jun 26, 2014
- RENESAS ELECTRONICS CORPORATION
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140073068
- Publication date Mar 13, 2014
- RENESAS ELECTRONICS CORPORATION
- Kenya HIRONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20130065364
- Publication date Mar 14, 2013
- RENESAS ELECTRIC CORPORATION
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INSPECTING SEMICONDUCTOR DEVICE
- Publication number 20120081702
- Publication date Apr 5, 2012
- Renesas Electronics Corporation
- Satoshi YAMADA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120061850
- Publication date Mar 15, 2012
- Renesas Electronics Corporation
- Soshi KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20110201155
- Publication date Aug 18, 2011
- Renesas Electronics Corporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110074019
- Publication date Mar 31, 2011
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20110076800
- Publication date Mar 31, 2011
- RENESAS ELECTRONICS CORPORATION
- Tatsuya HIRAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100320623
- Publication date Dec 23, 2010
- Renesas Electronics Corporation
- Soshi Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030011053
- Publication date Jan 16, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device constituting a CMOS camera system
- Publication number 20010050717
- Publication date Dec 13, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Satoshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20010042863
- Publication date Nov 22, 2001
- Satoshi Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Masatoshi Yasunaga

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device

Semiconductor device with copper wire having different width portions

Semiconductor device and method of manufacturing the same

Manufacturing method of semiconductor device

Method of inspecting semiconductor device

Manufacturing method of semiconductor device

Manufacturing method of semiconductor device

Semiconductor device having an improved mounting structure

Semiconductor device constituting a CMOS camera system

Method of manufacturing a packaged semiconductor device, and a semi...

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor device

Resin seal semiconductor package and manufacturing method of the same

Package for semiconductor device laminated printed circuit boards

Resin seal semiconductor package and manufacturing method of the same

Resin seal semiconductor package

Resin seal semiconductor package

Infrared radiation detector

Method of fabricating semiconductor device having sidewall spacers...

Method for manufacturing a resin encapsulated semiconductor device

Semiconductor device manufactured by using conductive ion implantat...

Lead frame and semiconductor device

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Manufacturing the Same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD OF INSPECTING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device

Semiconductor device constituting a CMOS camera system

Semiconductor device and manufacturing method thereof