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Masaya Kawano

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Patents Grantslast 30 patents

  • Information Patent Grant

    Seal device
    • Patent number 12,281,708
    • Issue date Apr 22, 2025
    • Mitsubishi Heavy Industries, Ltd.
    • Norihisa Takei
    • F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
  • Information Patent Grant

    Shaft sealing device and rotary machine
    • Patent number 12,247,490
    • Issue date Mar 11, 2025
    • Mitsubishi Heavy Industries, Ltd.
    • Kohei Ozaki
    • F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
  • Information Patent Grant

    Temperature measuring device, mechanical system, temperature measur...
    • Patent number 11,953,384
    • Issue date Apr 9, 2024
    • Mitsubishi Heavy Industries, Ltd.
    • Masaya Kawano
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Fluid film bearing
    • Patent number 11,795,997
    • Issue date Oct 24, 2023
    • Mitsubishi Heavy Industries, Ltd.
    • Yoshitomo Noda
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Grant

    Electronic device
    • Patent number 10,879,227
    • Issue date Dec 29, 2020
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic device
    • Patent number 10,580,763
    • Issue date Mar 3, 2020
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 10,224,318
    • Issue date Mar 5, 2019
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit device
    • Patent number 9,978,512
    • Issue date May 22, 2018
    • Renesas Electronics Corporation
    • Masaya Kawano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 9,847,325
    • Issue date Dec 19, 2017
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 9,524,953
    • Issue date Dec 20, 2016
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit device
    • Patent number 9,502,175
    • Issue date Nov 22, 2016
    • Renesas Electronics Corporation
    • Masaya Kawano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 9,406,602
    • Issue date Aug 2, 2016
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic device
    • Patent number 8,975,750
    • Issue date Mar 10, 2015
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device manufacturing method
    • Patent number 8,975,150
    • Issue date Mar 10, 2015
    • Renesas Electronics Corporation
    • Kentaro Mori
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Circuit device
    • Patent number 8,830,694
    • Issue date Sep 9, 2014
    • Renesas Electronics Corporation
    • Masaya Kawano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device
    • Patent number 8,823,174
    • Issue date Sep 2, 2014
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wear control apparatus and wind turbine blade monitoring system inc...
    • Patent number 8,739,612
    • Issue date Jun 3, 2014
    • Mitsubishi Heavy Industries, Ltd.
    • Masaya Kawano
    • F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
  • Information Patent Grant

    Semiconductor device comprising through-electrode interconnect
    • Patent number 8,704,355
    • Issue date Apr 22, 2014
    • Renesas Electronics Corporation
    • Masaya Kawano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device and method of manufacturing the same
    • Patent number 8,685,796
    • Issue date Apr 1, 2014
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Electronic device
    • Patent number 8,633,591
    • Issue date Jan 21, 2014
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring board, semiconductor device, and method for manufacturing wi...
    • Patent number 8,552,570
    • Issue date Oct 8, 2013
    • Renesas Electronics Corporation
    • Katsumi Kikuchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device and method for manufacturing the same
    • Patent number 8,536,691
    • Issue date Sep 17, 2013
    • Renesas Electronics Corporation
    • Katsumi Kikuchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 8,456,019
    • Issue date Jun 4, 2013
    • Renesas Electronics Corporation
    • Masaya Kawano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package and method of manufacturing the same
    • Patent number 8,456,020
    • Issue date Jun 4, 2013
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device having a through electrode
    • Patent number 8,436,468
    • Issue date May 7, 2013
    • Renesas Electronics Corporation
    • Masaya Kawano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of stacking semiconductor chips including forming an interco...
    • Patent number 8,395,269
    • Issue date Mar 12, 2013
    • Renesas Electronics Corporation
    • Masaya Kawano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic device and method of manufacturing the same
    • Patent number 8,354,340
    • Issue date Jan 15, 2013
    • Renesas Electronics Corporation
    • Yoichiro Kurita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device
    • Patent number 8,310,039
    • Issue date Nov 13, 2012
    • Renesas Electronics Corporation
    • Masaya Kawano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device and method for manufacturing the same
    • Patent number 8,304,915
    • Issue date Nov 6, 2012
    • NEC Corporation
    • Kentaro Mori
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor device
    • Patent number 8,183,685
    • Issue date May 22, 2012
    • Renesas Electronics Corporation
    • Masaya Kawano
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEALING DEVICE AND ROTATING MACHINE
    • Publication number 20250137383
    • Publication date May 1, 2025
    • Mitsubishi Heavy Industries, Ltd.
    • Azumi Yoshida
    • F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
  • Information Patent Application

    SEAL DEVICE, ROTATING MACHINE, AND METHOD FOR MOUNTING SEAL DEVICE
    • Publication number 20250137533
    • Publication date May 1, 2025
    • Mitsubishi Heavy Industries, Ltd.
    • Azumi Yoshida
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Application

    SEALING DEVICE AND ROTATING MACHINE
    • Publication number 20250035006
    • Publication date Jan 30, 2025
    • MITSUBISHI POWER, LTD.
    • Tatsuro FURUSHO
    • F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
  • Information Patent Application

    SHAFT SEALING DEVICE AND ROTARY MACHINE
    • Publication number 20240344463
    • Publication date Oct 17, 2024
    • Mitsubishi Heavy Industries, Ltd.
    • Kohei Ozaki
    • F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
  • Information Patent Application

    SEAL DEVICE
    • Publication number 20230341056
    • Publication date Oct 26, 2023
    • Mitsubishi Heavy Industries, Ltd.
    • Norihisa TAKEI
    • F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
  • Information Patent Application

    SEALING DEVICE AND ROTARY MACHINE
    • Publication number 20230258268
    • Publication date Aug 17, 2023
    • Mitsubishi Heavy Industries, Ltd.
    • Takashi Mitsumata
    • F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
  • Information Patent Application

    FLUID FILM BEARING
    • Publication number 20220316523
    • Publication date Oct 6, 2022
    • Mitsubishi Heavy Industries, Ltd.
    • Yoshitomo NODA
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Application

    TEMPERATURE MEASURING DEVICE, MECHANICAL SYSTEM, TEMPERATURE MEASUR...
    • Publication number 20220107228
    • Publication date Apr 7, 2022
    • Mitsubishi Heavy Industries, Ltd.
    • Masaya KAWANO
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20200118994
    • Publication date Apr 16, 2020
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20190139953
    • Publication date May 9, 2019
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20180019237
    • Publication date Jan 18, 2018
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20170236810
    • Publication date Aug 17, 2017
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT DEVICE
    • Publication number 20170053738
    • Publication date Feb 23, 2017
    • RENESAS ELECTRONICS CORPORATION
    • Masaya KAWANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20160307875
    • Publication date Oct 20, 2016
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20150137348
    • Publication date May 21, 2015
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20140346681
    • Publication date Nov 27, 2014
    • Yoichiro KURITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT DEVICE
    • Publication number 20140333149
    • Publication date Nov 13, 2014
    • Masaya Kawano
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20140103524
    • Publication date Apr 17, 2014
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIND TURBINE BLADE, METHOD FOR MANUFACTURING WIND TURBINE BLADE, AN...
    • Publication number 20130220005
    • Publication date Aug 29, 2013
    • Mitsubishi Heavy Industries, Ltd.
    • Masaya KAWANO
    • G01 - MEASURING TESTING
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20130099390
    • Publication date Apr 25, 2013
    • RENESAS ELECTRONICS CORPORATION
    • Yoichiro KURITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE COMPRISING THROUGH-ELECTRODE INTERCONNECT
    • Publication number 20130032930
    • Publication date Feb 7, 2013
    • RENESAS ELECTRONICS CORPORATION
    • Masaya KAWANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20120211872
    • Publication date Aug 23, 2012
    • RENESAS ELECTRONICS CORPORATION
    • Masaya KAWANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    • Publication number 20120153501
    • Publication date Jun 21, 2012
    • Renesas Electronics Corporation
    • Hideya Murai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE HAVING A THROUGH ELECTRODE
    • Publication number 20120104560
    • Publication date May 3, 2012
    • RENESAS ELECTRONICS CORPORATION
    • Masaya KAWANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING THROUGH EL...
    • Publication number 20120100715
    • Publication date Apr 26, 2012
    • RENESAS ELECTRONICS CORPORATION
    • Nobuaki TAKAHASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT DEVICE
    • Publication number 20120075050
    • Publication date Mar 29, 2012
    • RENESAS ELECTRONICS CORPORATION
    • Masaya KAWANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20110316124
    • Publication date Dec 29, 2011
    • RENESAS ELECTRONICS CORPORATION
    • Masaya KAWANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    • Publication number 20110281401
    • Publication date Nov 17, 2011
    • RENESAS ELECTRONICS CORPORATION
    • Kentaro MORI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE
    • Publication number 20110215478
    • Publication date Sep 8, 2011
    • NEC Corporation
    • Shintaro YAMAMICHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
    • Publication number 20110147058
    • Publication date Jun 23, 2011
    • RENESAS ELECTRONICS CORPORATION
    • Masaya KAWANO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR