Masaya Takeuchi

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Assemblies of stacked cassettes
- Patent number 9,117,864
- Issue date Aug 25, 2015
- Disco Corporation
- Nobukazu Dejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer dividing method
- Patent number 6,676,491
- Issue date Jan 13, 2004
- Disco Corporation
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer cutting machine
- Patent number 6,500,047
- Issue date Dec 31, 2002
- Disco Corporation
- Kazuhisa Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CASSETTE ASSEMBLY
- Publication number 20140231305
- Publication date Aug 21, 2014
- Disco Corporation
- Nobukazu Dejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Finishing machine using laser beam
- Publication number 20040164061
- Publication date Aug 26, 2004
- Masaya Takeuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wafer dividing method
- Publication number 20030013380
- Publication date Jan 16, 2003
- Kazuhisa Arai
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus for applying cleaning treatment to the surface of a proce...
- Publication number 20020185164
- Publication date Dec 12, 2002
- NEC Corporation
- Takashi Tetsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer cutting machine
- Publication number 20010029938
- Publication date Oct 18, 2001
- Kazuhisa Arai
- B28 - WORKING CEMENT, CLAY, OR STONE