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Masaya Takeuchi
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Assemblies of stacked cassettes
Patent number
9,117,864
Issue date
Aug 25, 2015
Disco Corporation
Nobukazu Dejima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer dividing method
Patent number
6,676,491
Issue date
Jan 13, 2004
Disco Corporation
Kazuhisa Arai
B24 - GRINDING POLISHING
Information
Patent Grant
Semiconductor wafer cutting machine
Patent number
6,500,047
Issue date
Dec 31, 2002
Disco Corporation
Kazuhisa Arai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
CASSETTE ASSEMBLY
Publication number
20140231305
Publication date
Aug 21, 2014
Disco Corporation
Nobukazu Dejima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Finishing machine using laser beam
Publication number
20040164061
Publication date
Aug 26, 2004
Masaya Takeuchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor wafer dividing method
Publication number
20030013380
Publication date
Jan 16, 2003
Kazuhisa Arai
B24 - GRINDING POLISHING
Information
Patent Application
Apparatus for applying cleaning treatment to the surface of a proce...
Publication number
20020185164
Publication date
Dec 12, 2002
NEC Corporation
Takashi Tetsuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor wafer cutting machine
Publication number
20010029938
Publication date
Oct 18, 2001
Kazuhisa Arai
B28 - WORKING CEMENT, CLAY, OR STONE