Masayoshi Joumen

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Chikusei-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flexible multilayer wiring board
- Patent number 8,232,476
- Issue date Jul 31, 2012
- Hitachi Chemical Company, Ltd.
- Shigehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD...
- Publication number 20140283972
- Publication date Sep 25, 2014
- Hitachi Chemical Company, Ltd.
- Tomoo Nishiyama
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, RESIN SHEET, AND CURED RESIN MATERIAL AND METHOD...
- Publication number 20120251830
- Publication date Oct 4, 2012
- Hitachi Chemical Company, Ltd.
- Tomoo Nishiyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING THE SAME, METHOD FO...
- Publication number 20120244351
- Publication date Sep 27, 2012
- Hideyuki Katagi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FLEXIBLE MULTILAYER WIRING BOARD
- Publication number 20100084169
- Publication date Apr 8, 2010
- Shigehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photosensitive resin composition, and photosensitive element, metho...
- Publication number 20060141381
- Publication date Jun 29, 2006
- Hitachi Chemical Co., Ltd.
- Toshizumi Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR