Masayoshi Kido

Person

Shiga, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition, thermosetting resin film, thermose...
- Patent number 12,227,609
- Issue date Feb 18, 2025
- Kaneka Corporation
- Fumiya Kono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low dielectric resin composition, molded article, film, multilayer...
- Patent number 11,993,740
- Issue date May 28, 2024
- Kaneka Corporation
- Yuichi Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, cured film and method for producin...
- Patent number 10,975,263
- Issue date Apr 13, 2021
- Kaneka Corporation
- Masayoshi Kido
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Black resin composition, polyimide with black resin cured film and...
- Patent number 10,822,465
- Issue date Nov 3, 2020
- Kaneka Corporation
- Tetsuya Kogiso
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Reinforcing-plate-integrated flexible printed circuit board
- Patent number 10,292,262
- Issue date May 14, 2019
- Kaneka Corporation
- Masayoshi Kido
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive-layer-integrated flexible printed circuit board
- Patent number 10,045,433
- Issue date Aug 7, 2018
- Kaneka Corporation
- Masayoshi Kido
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Black photosensitive resin composition and use of same
- Patent number 10,030,133
- Issue date Jul 24, 2018
- Kaneka Corporation
- Masayoshi Kido
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition and use thereof
- Patent number 9,835,942
- Issue date Dec 5, 2017
- Kaneka Corporation
- Yoshihide Sekito
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Conductive-layer-integrated flexible printed circuit board
- Patent number 9,723,708
- Issue date Aug 1, 2017
- Kaneka Corporation
- Masayoshi Kido
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Flexible printed circuit integrated with conductive layer
- Patent number 9,237,645
- Issue date Jan 12, 2016
- Kaneka Corporation
- Masayoshi Kido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit integrated with stiffener
- Patent number 9,204,528
- Issue date Dec 1, 2015
- Kaneka Corporation
- Masayoshi Kido
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive layer integrated FPC
- Patent number 9,072,177
- Issue date Jun 30, 2015
- Kaneka Corporation
- Masayoshi Kido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board integrated with reinforcing plate, a...
- Patent number 8,828,525
- Issue date Sep 9, 2014
- Kaneka Corporation
- Masayoshi Kido
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
THERMOPLASTIC RESIN COMPOSITION AND METHOD FOR PRODUCING SAME
- Publication number 20220363892
- Publication date Nov 17, 2022
- Kaneka Corporation
- Yuichi Imamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN FILM, THERMOSE...
- Publication number 20220153909
- Publication date May 19, 2022
- Kaneka Corporation
- Fumiya Kono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW DIELECTRIC RESIN COMPOSITION, MOLDED ARTICLE, FILM, MULTILAYER...
- Publication number 20220041932
- Publication date Feb 10, 2022
- Kaneka Corporation
- Yuichi Imamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20200045833
- Publication date Feb 6, 2020
- KANEKA CORPORATION
- Yuji ASAHINA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, CURED FILM AND METHOD FOR PRODUCIN...
- Publication number 20190161638
- Publication date May 30, 2019
- KANEKA CORPORATION
- Masayoshi KIDO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BLACK RESIN COMPOSITION, POLYIMIDE WITH BLACK RESIN CURED FILM AND...
- Publication number 20180319945
- Publication date Nov 8, 2018
- KANEKA CORPORATION
- Tetsuya KOGISO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20170290141
- Publication date Oct 5, 2017
- Kaneka Corporation
- Masayoshi Kido
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20150195899
- Publication date Jul 9, 2015
- Kaneka Corporation
- Masayoshi Kido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REINFORCING-PLATE-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20150189740
- Publication date Jul 2, 2015
- Masayoshi Kido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BLACK PHOTOSENSITIVE RESIN COMPOSITION AND USE OF SAME
- Publication number 20150044451
- Publication date Feb 12, 2015
- Kaneka Corporation
- Masayoshi Kido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL CONDUCTIVE LAYER INTEGRATED FPC
- Publication number 20140158412
- Publication date Jun 12, 2014
- Kaneka Corporation
- Masayoshi Kido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH CONDUCTIVE LAYER
- Publication number 20140054081
- Publication date Feb 27, 2014
- Kaneka Corporation
- Masayoshi Kido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH REINFORCING PLATE
- Publication number 20140048314
- Publication date Feb 20, 2014
- Kaneka Corporation
- Masayoshi Kido
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
NOVEL PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF
- Publication number 20130264099
- Publication date Oct 10, 2013
- Kaneka Corporation
- Yoshihide Sekido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE, A...
- Publication number 20130183499
- Publication date Jul 18, 2013
- KANEKA CORPORATION
- Masayoshi Kido
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Masayoshi Kido

Person

Patents Grantslast 30 patents

Thermosetting resin composition, thermosetting resin film, thermose...

Low dielectric resin composition, molded article, film, multilayer...

Thermosetting resin composition, cured film and method for producin...

Black resin composition, polyimide with black resin cured film and...

Reinforcing-plate-integrated flexible printed circuit board

Conductive-layer-integrated flexible printed circuit board

Black photosensitive resin composition and use of same

Photosensitive resin composition and use thereof

Conductive-layer-integrated flexible printed circuit board

Flexible printed circuit integrated with conductive layer

Flexible printed circuit integrated with stiffener

Conductive layer integrated FPC

Flexible printed circuit board integrated with reinforcing plate, a...

Patents Applicationslast 30 patents

THERMOPLASTIC RESIN COMPOSITION AND METHOD FOR PRODUCING SAME

THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN FILM, THERMOSE...

LOW DIELECTRIC RESIN COMPOSITION, MOLDED ARTICLE, FILM, MULTILAYER...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

THERMOSETTING RESIN COMPOSITION, CURED FILM AND METHOD FOR PRODUCIN...

BLACK RESIN COMPOSITION, POLYIMIDE WITH BLACK RESIN CURED FILM AND...

CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD

CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD

REINFORCING-PLATE-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD

BLACK PHOTOSENSITIVE RESIN COMPOSITION AND USE OF SAME

NOVEL CONDUCTIVE LAYER INTEGRATED FPC

NOVEL FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH CONDUCTIVE LAYER

FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH REINFORCING PLATE

NOVEL PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF

FLEXIBLE PRINTED CIRCUIT BOARD INTEGRATED WITH REINFORCING PLATE, A...