Masayoshi Kohinata

Follow

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Au—Sn alloy bump including no large void and method of producing same
- Patent number 8,721,961
- Issue date May 13, 2014
- Mitsubishi Materials Corporation
- Masayuki Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Au-sn alloy powder for solder paste
- Patent number 7,556,669
- Issue date Jul 7, 2009
- Mitsubishi Materials Corporation
- Masayuki Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating solution for forming Pb-Sn alloy bump electrodes on...
- Patent number 5,651,873
- Issue date Jul 29, 1997
- Mitsubishi Materials Corporation
- Naoki Uchiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for joining ceramic sintered bodies
- Patent number 5,451,279
- Issue date Sep 19, 1995
- Mitsubishi Materials Corporation
- Masayoshi Kohinata
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Au-Sn Alloy Bump Having no Trapped-In Large Void and Process for Pr...
- Publication number 20080304999
- Publication date Dec 11, 2008
- MITSUBISHI MATERIALS CORPORATION
- Masayuki Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Au-sn alloy powder for solder paste
- Publication number 20070183922
- Publication date Aug 9, 2007
- Mitsubishi Materials Corporation
- Masayuki Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tin-containing plating bath
- Publication number 20060113006
- Publication date Jun 1, 2006
- Akihiro Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR