Masayoshi Koyama

Person

Tondabayashi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Paste dispenser for applying paste containing fillers using nozzle...
- Patent number 9,162,249
- Issue date Oct 20, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Masayoshi Koyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,076,752
- Issue date Jul 7, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board connection method
- Patent number 8,353,102
- Issue date Jan 15, 2013
- Panasonic Corporation
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining electronic component and the electronic component
- Patent number 8,304,338
- Issue date Nov 6, 2012
- Panasonic Corporation
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for jointing circuit board
- Patent number 8,115,109
- Issue date Feb 14, 2012
- Panasonic Corporation
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump forming method and bump forming apparatus
- Patent number 7,905,011
- Issue date Mar 15, 2011
- Panasonic Corporation
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plasma display panel cutting method
- Patent number 7,753,752
- Issue date Jul 13, 2010
- Panasonic Corporation
- Nobuyuki Kirihara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Multilayer circuit board and manufacturing method thereof
- Patent number 7,737,367
- Issue date Jun 15, 2010
- Panasonic Corporation
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing component built-in module, and component b...
- Patent number 7,488,895
- Issue date Feb 10, 2009
- Panasonic Corporation
- Yoshitake Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating semiconductor-mounting body and apparatus fo...
- Patent number 6,613,180
- Issue date Sep 2, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yoshitaka Sunagawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140231981
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Toshiyuki Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF JOINING ELECTRONIC COMPONENT AND THE ELECTRONIC COMPONENT
- Publication number 20100244283
- Publication date Sep 30, 2010
- PANASONIC CORPORATION
- Norihito Tsukahara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PASTE APPLICATOR AND PASTE APPLICATION METHOD
- Publication number 20100080912
- Publication date Apr 1, 2010
- PANASONIC CORPORATION
- Masayoshi Koyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD
- Publication number 20090266592
- Publication date Oct 29, 2009
- Panasonic Corporation
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
- Publication number 20090229120
- Publication date Sep 17, 2009
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLASMA DISPLAY PANEL CUTTING METHOD, PLASMA DISPLAY PANEL RECYCLING...
- Publication number 20090156081
- Publication date Jun 18, 2009
- Matsushita Electric Industrial Co., Ltd.
- Nobuyuki Kirihara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING BOARD CONNECTION METHOD AND WIRING BOARD
- Publication number 20080283284
- Publication date Nov 20, 2008
- Matsushita Electric Industrial Co., Ltd.
- Masayoshi KOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing component built-in module, and component b...
- Publication number 20070119617
- Publication date May 31, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshitake Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer circuit board and manufacturing method thereof
- Publication number 20060191715
- Publication date Aug 31, 2006
- Matsushita Electric Industrial Co., Ltd.
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating semiconductor-mounting body and apparatus fo...
- Publication number 20030027371
- Publication date Feb 6, 2003
- Yoshitaka Sunagawa
- H01 - BASIC ELECTRIC ELEMENTS

Masayoshi Koyama

Person

Patents Grantslast 30 patents

Paste dispenser for applying paste containing fillers using nozzle...

Semiconductor device and method for manufacturing the same

Wiring board connection method

Method of joining electronic component and the electronic component

Circuit board and method for jointing circuit board

Bump forming method and bump forming apparatus

Plasma display panel cutting method

Multilayer circuit board and manufacturing method thereof

Method for manufacturing component built-in module, and component b...

Method for fabricating semiconductor-mounting body and apparatus fo...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF JOINING ELECTRONIC COMPONENT AND THE ELECTRONIC COMPONENT

PASTE APPLICATOR AND PASTE APPLICATION METHOD

CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD

BUMP FORMING METHOD AND BUMP FORMING APPARATUS

PLASMA DISPLAY PANEL CUTTING METHOD, PLASMA DISPLAY PANEL RECYCLING...

WIRING BOARD CONNECTION METHOD AND WIRING BOARD

Method for manufacturing component built-in module, and component b...

Multilayer circuit board and manufacturing method thereof

Method for fabricating semiconductor-mounting body and apparatus fo...