Masayoshi Sekizawa

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Niigata, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing polishing pad, and method for polishing wafer
- Patent number 8,287,331
- Issue date Oct 16, 2012
- Shin-Etsu Handotai Co., Ltd.
- Koichi Kanaya
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing semiconductor wafer and semiconductor wafer
- Patent number 7,507,146
- Issue date Mar 24, 2009
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing polishing pad, polishing pad, and method f...
- Publication number 20080248728
- Publication date Oct 9, 2008
- Shin-Etsu Handotai Co., Ltd.
- Koichi Kanaya
- B24 - GRINDING POLISHING
Information Patent Application
Method for Producing Semiconductor Wafer and Semiconductor Wafer
- Publication number 20080096474
- Publication date Apr 24, 2008
- SHIN-ETSU HANDOTAI CO., LTD.
- Tadahiro Kato
- B24 - GRINDING POLISHING