Masayoshi Shimoda

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder alloy for die bonding
- Patent number 10,189,119
- Issue date Jan 29, 2019
- Nihon Handa Co., Ltd.
- Takeshi Asagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor module including solid-liquid...
- Patent number 7,670,879
- Issue date Mar 2, 2010
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230238299
- Publication date Jul 27, 2023
- Fuji Electric Co., Ltd.
- Seiichi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER ALLOY FOR DIE BONDING
- Publication number 20150258637
- Publication date Sep 17, 2015
- Nihon Handa Co., Ltd.
- Takeshi Asagi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Manufacturing method of semiconductor module
- Publication number 20070197017
- Publication date Aug 23, 2007
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic part mounting method
- Publication number 20070152025
- Publication date Jul 5, 2007
- Fuji Electric Holdings Co., Ltd.
- Kozo Fujimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR