Masayoshi Shinoda

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Kodaira, JP

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Patents Grantslast 30 patents

Information Patent Grant
Flip chip assembly structure for semiconductor device and method of...
- Patent number 6,798,072
- Issue date Sep 28, 2004
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,784,554
- Issue date Aug 31, 2004
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030127747
- Publication date Jul 10, 2003
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip assembly structure for semiconductor device and method of...
- Publication number 20020056906
- Publication date May 16, 2002
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS