Masayoshi Tagami

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,198,730
- Issue date Jun 12, 2012
- NEC Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered wiring structure, and method for manufacturing multila...
- Patent number 7,999,391
- Issue date Aug 16, 2011
- NEC Corporation
- Hiroto Ootake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and having trench interconnection
- Patent number 7,622,808
- Issue date Nov 24, 2009
- NEC Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered wiring layer and method of fabricating the same
- Patent number 6,538,324
- Issue date Mar 25, 2003
- NEC Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYERED WIRING STRUCTURE, AND METHOD FOR MANUFACTURING MULTILA...
- Publication number 20100219533
- Publication date Sep 2, 2010
- NEC CORPORATION
- Hiroto Ootake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100096756
- Publication date Apr 22, 2010
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having trench interconnection and manufacturin...
- Publication number 20060131754
- Publication date Jun 22, 2006
- NEC Corporation
- Hiroto Ohtake
- H01 - BASIC ELECTRIC ELEMENTS