Masayuki IWASAKI

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cyclic imide resin composition, prepreg, copper-clad laminate and p...
- Patent number 12,146,057
- Issue date Nov 19, 2024
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INSULATING COATING MATERIAL FOR COATING ELECTRIC WIRE, INSULATED WI...
- Publication number 20250140438
- Publication date May 1, 2025
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...
- Publication number 20250084216
- Publication date Mar 13, 2025
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...
- Publication number 20240247128
- Publication date Jul 25, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED...
- Publication number 20240191029
- Publication date Jun 13, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masayuki IWASAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE BISMALEIMIDE RESIN COMPOSITION
- Publication number 20240084075
- Publication date Mar 14, 2024
- Shin-Etsu Chemical Co., Ltd.
- Masayuki IWASAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-WIRING BOARD (FPC), AND H...
- Publication number 20220306920
- Publication date Sep 29, 2022
- Shin-Etsu Chemical Co., Ltd.
- Atsushi TSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CYCLIC IMIDE RESIN COMPOSITION, PREPREG, COPPER-CLAD LAMINATE AND P...
- Publication number 20220195189
- Publication date Jun 23, 2022
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Masayuki IWASAKI

Person

Patents Grantslast 30 patents

Cyclic imide resin composition, prepreg, copper-clad laminate and p...

Patents Applicationslast 30 patents

INSULATING COATING MATERIAL FOR COATING ELECTRIC WIRE, INSULATED WI...

CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...

CURABLE MALEIMIDE RESIN COMPOSITION, ADHESIVE, PRIMER, CHIP COATING...

HEAT-CURABLE IMIDE RESIN COMPOSITION, AND UNCURED RESIN FILM, CURED...

HEAT-CURABLE BISMALEIMIDE RESIN COMPOSITION

ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-WIRING BOARD (FPC), AND H...

CYCLIC IMIDE RESIN COMPOSITION, PREPREG, COPPER-CLAD LAMINATE AND P...