Masayuki Kiso

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Turbulence-reducing device for stirring a surface treatment solution
- Patent number 11,891,698
- Issue date Feb 6, 2024
- C. Uyemura & Co., Ltd.
- Tomoji Okuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treatment device comprising a paddle for stirring a surface...
- Patent number 11,173,513
- Issue date Nov 16, 2021
- C. Uyemura & Co., Ltd.
- Tomoji Okuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless nickel plating bath and method for electroless nickel p...
- Patent number 8,292,993
- Issue date Oct 23, 2012
- C. Uyemura & Co., Ltd.
- Hiromu Inagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless gold plating method and electronic parts
- Patent number 8,124,174
- Issue date Feb 28, 2012
- C. Uyemura & Co., Ltd.
- Seigo Kurosaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless gold plating bath, electroless gold plating method and...
- Patent number 7,988,773
- Issue date Aug 2, 2011
- C. Uyemura & Co., Ltd.
- Masayuki Kiso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless gold plating bath, electroless gold plating method and...
- Patent number 7,985,285
- Issue date Jul 26, 2011
- C. Uyemura & Co., Ltd.
- Masayuki Kiso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless nickel plating solution and method
- Patent number 5,910,340
- Issue date Jun 8, 1999
- C. Uyemura & Co., Ltd.
- Hiroki Uchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Analysis of tin, lead or tin-lead alloy plating solution
- Patent number 5,294,554
- Issue date Mar 15, 1994
- C. Uyemura & Co., Ltd.
- Hiroki Uchida
- G01 - MEASURING TESTING
Information Patent Grant
Bath and method for the electroless plating of tin and tin-lead alloy
- Patent number 5,266,103
- Issue date Nov 30, 1993
- C. Uyemura & Co., Ltd.
- Hiroki Uchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for electroless plating tin, lead or tin-lead alloy
- Patent number 5,248,527
- Issue date Sep 28, 1993
- C. Uyemura and Company, Limited
- Hiroki Uchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal ion replenishment to plating bath
- Patent number 5,234,572
- Issue date Aug 10, 1993
- C. Uyemura & Co., Ltd.
- Hiroki Uchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Gold plating bath and method
- Patent number 4,913,787
- Issue date Apr 3, 1990
- C. Uyemura & Co., Ltd.
- Masayuki Kiso
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroless gold plating solution
- Patent number 4,792,469
- Issue date Dec 20, 1988
- C. Uyemura & Co., Ltd.
- Masahiro Saito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR REPRODUCING PLATING SOLUTION
- Publication number 20210172084
- Publication date Jun 10, 2021
- C. Uyemura & Co., Ltd.
- Daisuke HASHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface Treatment Device, Surface Treatment Method And Paddle
- Publication number 20210102295
- Publication date Apr 8, 2021
- C. Uyemura & Co., Ltd.
- Tomoji Okuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC SN OR SN ALLOY PLATING SOLUTION AND METHOD FOR PRODUCI...
- Publication number 20200208285
- Publication date Jul 2, 2020
- C. Uyemura & Co., Ltd.
- Masato Enomoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC TIN ALLOY PLATING SOLUTION
- Publication number 20200123673
- Publication date Apr 23, 2020
- C. Uyemura & Co., Ltd.
- Daisuke HASHIMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC TIN PLATING SOLUTION
- Publication number 20200095698
- Publication date Mar 26, 2020
- C. Uyemura & Co., Ltd.
- Daisuke HASHIMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE TREATMENT DEVICE, SURFACE TREATMENT METHOD AND PADDLE
- Publication number 20190309435
- Publication date Oct 10, 2019
- C. Uyemura & Co., Ltd.
- Tomoji Okuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS NICKEL PLATING BATH AND METHOD FOR ELECTROLESS NICKEL P...
- Publication number 20100136244
- Publication date Jun 3, 2010
- C. Uyemura & Co., Ltd.
- Hiromu Inagawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS GOLD PLATING METHOD AND ELECTRONIC PARTS
- Publication number 20080277140
- Publication date Nov 13, 2008
- C. Uyemura & Co., Ltd.
- Seigo KUROSAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING A DISPLACEMENT TIN ALLOY PLATED FILM, DISPLACEME...
- Publication number 20080173550
- Publication date Jul 24, 2008
- C. Uyemura & Co., Ltd.
- Masayuki KISO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless gold plating bath, electroless gold plating method and...
- Publication number 20080138506
- Publication date Jun 12, 2008
- C. Uyemura & Co., Ltd.
- Masayuki Kiso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless gold plating bath, electroless gold plating method and...
- Publication number 20080138507
- Publication date Jun 12, 2008
- C. Uyemura & Co., Ltd.
- Masayuki Kiso
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Masayuki Kiso

Person

Patents Grantslast 30 patents

Turbulence-reducing device for stirring a surface treatment solution

Surface treatment device comprising a paddle for stirring a surface...

Electroless nickel plating bath and method for electroless nickel p...

Electroless gold plating method and electronic parts

Electroless gold plating bath, electroless gold plating method and...

Electroless gold plating bath, electroless gold plating method and...

Electroless nickel plating solution and method

Analysis of tin, lead or tin-lead alloy plating solution

Bath and method for the electroless plating of tin and tin-lead alloy

Process for electroless plating tin, lead or tin-lead alloy

Metal ion replenishment to plating bath

Gold plating bath and method

Electroless gold plating solution

Patents Applicationslast 30 patents

METHOD FOR REPRODUCING PLATING SOLUTION

Surface Treatment Device, Surface Treatment Method And Paddle

ELECTROLYTIC SN OR SN ALLOY PLATING SOLUTION AND METHOD FOR PRODUCI...

ELECTROLYTIC TIN ALLOY PLATING SOLUTION

ELECTROLYTIC TIN PLATING SOLUTION

SURFACE TREATMENT DEVICE, SURFACE TREATMENT METHOD AND PADDLE

ELECTROLESS NICKEL PLATING BATH AND METHOD FOR ELECTROLESS NICKEL P...

ELECTROLESS GOLD PLATING METHOD AND ELECTRONIC PARTS

METHOD FOR FORMING A DISPLACEMENT TIN ALLOY PLATED FILM, DISPLACEME...

Electroless gold plating bath, electroless gold plating method and...

Electroless gold plating bath, electroless gold plating method and...