Masayuki Kyooi

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Yokohama, JP

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer wiring substrate and manufacturing method thereof
- Patent number 6,506,982
- Issue date Jan 14, 2003
- Hitachi, Ltd.
- Hidetaka Shigi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating an interconnected multilayer board
- Patent number 5,388,328
- Issue date Feb 14, 1995
- Hitachi, Ltd.
- Hitoshi Yokono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnected multilayer boards and fabrication processes thereof
- Patent number 5,300,735
- Issue date Apr 5, 1994
- Hitachi, Ltd.
- Hitoshi Yokono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hot press
- Patent number 5,182,121
- Issue date Jan 26, 1993
- Hitachi, Ltd.
- Akimi Miyashita
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of forming a multilayer printed circuit board and apparatus...
- Patent number 4,908,087
- Issue date Mar 13, 1990
- Hitachi, Ltd.
- Hideyasu Murooka
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Multi-layer wiring substrate and manufacturing method thereof
- Publication number 20030019663
- Publication date Jan 30, 2003
- Hidetaka Shigi
- H01 - BASIC ELECTRIC ELEMENTS