Masayuki MOCHIZUKI

Person

Kumagaya-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus and manufacturing method for semiconductor de...
- Patent number 12,068,275
- Issue date Aug 20, 2024
- FASFORD TECHNOLOGY CO., LTD.
- Ryo Saegusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and bonding method
- Patent number 10,096,526
- Issue date Oct 9, 2018
- FASFORD TECHNOLOGY CO., LTD.
- Masayuki Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-shaft drive mechanism and die bonder
- Patent number 9,324,679
- Issue date Apr 26, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Yoshihide Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reaction absorber and semiconductor assembling system
- Patent number 9,177,937
- Issue date Nov 3, 2015
- FASFORD TECHNOLOGY CO., LTD.
- Masayuki Mochizuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Die bonder and bonding method
- Patent number 8,991,681
- Issue date Mar 31, 2015
- Hitachi High-Tech Instuments Co., Ltd.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foreign substance removing device and die bonder equipped with the...
- Patent number 8,783,319
- Issue date Jul 22, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Takashi Yamagami
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 8,703,583
- Issue date Apr 22, 2014
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 8,574,933
- Issue date Nov 5, 2013
- Renesas Electronics Corporation
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 8,367,433
- Issue date Feb 5, 2013
- Renesas Electronics Corporation
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 7,824,932
- Issue date Nov 2, 2010
- Renesas Electronics Corporation
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 7,629,231
- Issue date Dec 8, 2009
- Renesas Technology Corp.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor Ap...
- Publication number 20220199433
- Publication date Jun 23, 2022
- Fasford Technology Co., Ltd.
- Hideharu Kobashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor De...
- Publication number 20220052017
- Publication date Feb 17, 2022
- Fasford Technology Co., Ltd.
- Ryo SAEGUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die...
- Publication number 20140074280
- Publication date Mar 13, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Yoshihide ISHII
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Two-Shaft Drive Mechanism and Die Bonder
- Publication number 20130221764
- Publication date Aug 29, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Yoshihide ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20130122615
- Publication date May 16, 2013
- RENESAS ELECTRONICS CORPORATION
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Bonding Method
- Publication number 20130068824
- Publication date Mar 21, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Masayuki MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Bonding Method
- Publication number 20130068823
- Publication date Mar 21, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Hiroshi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder and Bonding Method
- Publication number 20130068826
- Publication date Mar 21, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Hiroshi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Foreign Substance Removing Device and Die Bonder Equipped with the...
- Publication number 20120241096
- Publication date Sep 27, 2012
- Hitachi High-Tech Instruments Co., Ltd.
- Takashi YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REACTION ABSORBER AND SEMICONDUCTOR ASSEMBLING SYSTEM
- Publication number 20110259525
- Publication date Oct 27, 2011
- Masayuki MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20100285615
- Publication date Nov 11, 2010
- RENESAS TECHNOLOGY CORP.
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Method of Semiconductor Device
- Publication number 20100055878
- Publication date Mar 4, 2010
- RENESAS TECHNOLOGY CORP.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20090215204
- Publication date Aug 27, 2009
- RENESAS TECHNOLOGY CORP.
- Hideharu KOBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20080057599
- Publication date Mar 6, 2008
- Hideharu Kobashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20070275544
- Publication date Nov 29, 2007
- RENESAS TECHNOLOGY CORP.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS

Masayuki MOCHIZUKI

Person

Patents Grantslast 30 patents

Die bonding apparatus and manufacturing method for semiconductor de...

Die bonder and bonding method

Two-shaft drive mechanism and die bonder

Reaction absorber and semiconductor assembling system

Die bonder and bonding method

Foreign substance removing device and die bonder equipped with the...

Fabrication method of semiconductor device

Fabrication method of semiconductor device

Fabrication method of semiconductor device

Fabrication method of semiconductor device

Fabrication method of semiconductor device

Patents Applicationslast 30 patents

Die Bonding Apparatus and Manufacturing Method for Semiconductor Ap...

Die Bonding Apparatus and Manufacturing Method for Semiconductor De...

Horizontal Axis Drive Mechanism, Two-Axis Drive Mechanism, and Die...

Two-Shaft Drive Mechanism and Die Bonder

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

Die Bonder and Bonding Method

Die Bonder and Bonding Method

Die Bonder and Bonding Method

Foreign Substance Removing Device and Die Bonder Equipped with the...

REACTION ABSORBER AND SEMICONDUCTOR ASSEMBLING SYSTEM

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

Fabrication Method of Semiconductor Device

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

FABRICATION METHOD OF SEMICONDUCTOR DEVICE