Masayuki Nagasawa

Person

Kawagoe-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing agent and polishing method
- Patent number 7,026,245
- Issue date Apr 11, 2006
- Renesas Technology Corp.
- Yoshio Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarizing method of semiconductor wafer and apparatus thereof
- Patent number 6,777,337
- Issue date Aug 17, 2004
- Renesas Technology Corporation
- Kan Yasui
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing surface of semiconductor device substrate
- Patent number 6,663,468
- Issue date Dec 16, 2003
- Hitachi, Ltd.
- Yoshio Kawamura
- B24 - GRINDING POLISHING
Information Patent Grant
Processing method, measuring method and producing method of semicon...
- Patent number 6,589,871
- Issue date Jul 8, 2003
- Hitachi, Ltd.
- Yoshio Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for planarizing semiconductor device
- Patent number 6,565,424
- Issue date May 20, 2003
- Hitachi, Ltd.
- Souichi Katagiri
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing agent and polishing method
- Patent number 6,043,155
- Issue date Mar 28, 2000
- Hitachi, Ltd.
- Yoshio Homma
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing agent and polishing method
- Patent number 5,772,780
- Issue date Jun 30, 1998
- Hitachi, Ltd.
- Yoshio Homma
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Method for polishing surface of semiconductor device substrate
- Publication number 20040048554
- Publication date Mar 11, 2004
- Hitachi, Ltd.
- Yoshio Kawamura
- B24 - GRINDING POLISHING
Information Patent Application
Polishing agent and polishing method
- Publication number 20030203634
- Publication date Oct 30, 2003
- Yoshio Homma
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Processing method, measuring method and producing method of semicon...
- Publication number 20020076933
- Publication date Jun 20, 2002
- Hitachi, Ltd.
- Yoshio Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing agent and polishing method
- Publication number 20020068452
- Publication date Jun 6, 2002
- Yoshio Homma
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method and apparatus for planarizing semiconductor device
- Publication number 20020049026
- Publication date Apr 25, 2002
- Souichi Katagiri
- B24 - GRINDING POLISHING
Information Patent Application
Planarizing method of semiconductor wafer and apparatus thereof
- Publication number 20020028581
- Publication date Mar 7, 2002
- HITACHI LTD.
- Kan Yasui
- B24 - GRINDING POLISHING
Information Patent Application
Method for polishing surface of semicon-ductor device substrate
- Publication number 20010007795
- Publication date Jul 12, 2001
- Yoshio Kawamura
- B24 - GRINDING POLISHING

Masayuki Nagasawa

Person

Patents Grantslast 30 patents

Polishing agent and polishing method

Planarizing method of semiconductor wafer and apparatus thereof

Method for polishing surface of semiconductor device substrate

Processing method, measuring method and producing method of semicon...

Method and apparatus for planarizing semiconductor device

Polishing agent and polishing method

Polishing agent and polishing method

Patents Applicationslast 30 patents

Method for polishing surface of semiconductor device substrate

Polishing agent and polishing method

Processing method, measuring method and producing method of semicon...

Polishing agent and polishing method

Method and apparatus for planarizing semiconductor device

Planarizing method of semiconductor wafer and apparatus thereof

Method for polishing surface of semicon-ductor device substrate