Masayuki Nakamura

Person

Kanuma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bumpless semiconductor device
- Patent number 7,638,876
- Issue date Dec 29, 2009
- Sony Chemical & Information Device Corporation
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumpless semiconductor device
- Patent number 7,109,058
- Issue date Sep 19, 2006
- Sony Chemicals Corp.
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible wiring boards
- Patent number 7,053,312
- Issue date May 30, 2006
- Sony Corporation
- Hiroyuki Hishinuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing multilayer flexible wiring boards
- Patent number 6,991,148
- Issue date Jan 31, 2006
- Sony Corporation
- Hideyuki Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic manufacturing apparatus
- Patent number 6,926,187
- Issue date Aug 9, 2005
- Sony Chemicals Corp.
- Hideyuki Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing flexible wiring boards
- Patent number 6,848,176
- Issue date Feb 1, 2005
- Sony Chemicals Corporation
- Hiroyuki Hishinuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate piece and flexible substrate
- Patent number 6,717,064
- Issue date Apr 6, 2004
- Sony Chemicals Corp.
- Hideyuki Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processes for manufacturing flexible wiring boards
- Patent number 6,643,923
- Issue date Nov 11, 2003
- Sony Chemicals Corp.
- Hiroyuki Hishinuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic manufacturing apparatuses, multilayer flexible wiring bo...
- Patent number 6,583,364
- Issue date Jun 24, 2003
- Sony Chemicals Corp.
- Hideyuki Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer flexible printed wiring board
- Patent number 6,404,052
- Issue date Jun 11, 2002
- Sony Chemicals Corp.
- Hideyuki Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer boards
- Patent number 6,399,891
- Issue date Jun 4, 2002
- Sony Chemicals Corporation
- Hideyuki Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer flexible wiring boards
- Patent number 6,395,993
- Issue date May 28, 2002
- Sony Chemicals Corp.
- Masayuki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bumpless semiconductor device
- Publication number 20060249856
- Publication date Nov 9, 2006
- Sony Chemicals Corp.
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for manufacturing multilayer flexible wiring boards
- Publication number 20050028358
- Publication date Feb 10, 2005
- Sony Chemicals Corp.
- Hideyuki Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bumpless semiconductor device
- Publication number 20040217460
- Publication date Nov 4, 2004
- Yukio Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible wiring boards
- Publication number 20040045157
- Publication date Mar 11, 2004
- SONY CHEMICALS CORP.
- Hiroyuki Hishinuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Processes for manufacturing flexible wiring boards
- Publication number 20040045737
- Publication date Mar 11, 2004
- SONY CHEMICALS CORP.
- Hiroyuki Hishinuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultrasonic manufacturing apparatus
- Publication number 20030234085
- Publication date Dec 25, 2003
- Sony Chemicals Corp.
- Hideyuki Kurita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Masayuki Nakamura

Person

Patents Grantslast 30 patents

Bumpless semiconductor device

Bumpless semiconductor device

Flexible wiring boards

Process for manufacturing multilayer flexible wiring boards

Ultrasonic manufacturing apparatus

Process for manufacturing flexible wiring boards

Substrate piece and flexible substrate

Processes for manufacturing flexible wiring boards

Ultrasonic manufacturing apparatuses, multilayer flexible wiring bo...

Multi-layer flexible printed wiring board

Multilayer boards

Multilayer flexible wiring boards

Patents Applicationslast 30 patents

Bumpless semiconductor device

Process for manufacturing multilayer flexible wiring boards

Bumpless semiconductor device

Flexible wiring boards

Processes for manufacturing flexible wiring boards

Ultrasonic manufacturing apparatus