Masayuki Nakano

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
System, method, and program for managing evaluation of avatar images
- Patent number 10,839,584
- Issue date Nov 17, 2020
- DeNA Co., Ltd.
- Masatoshi Inagawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor light emitting diode and method of producing the same
- Patent number 9,287,458
- Issue date Mar 15, 2016
- Dowa Electronics Materials Co., Ltd.
- Hiroyuki Togawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting diode and method of producing the same
- Patent number 8,809,894
- Issue date Aug 19, 2014
- Dowa Electronics Materials Co., Ltd.
- Masayuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder layer and device bonding substrate using the same and method...
- Patent number 8,747,579
- Issue date Jun 10, 2014
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Submount
- Patent number 8,581,106
- Issue date Nov 12, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder layer, substrate for device joining utilizing the same and m...
- Patent number 8,516,692
- Issue date Aug 27, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Submount and method of manufacturing the same
- Patent number 8,472,208
- Issue date Jun 25, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder layer and electronic device bonding substrate and submount u...
- Patent number 8,404,359
- Issue date Mar 26, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder layer, heat sink using such a solder layer and method for ma...
- Patent number 8,310,047
- Issue date Nov 13, 2012
- Dowa Electronics Materials Co., Ltd.
- Masayuki Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module with lever that abuts case to release latch from loc...
- Patent number 7,325,975
- Issue date Feb 5, 2008
- NEC Corporation
- Yasushi Yamada
- G02 - OPTICS
Information Patent Grant
Circuit and method for monitoring optical signal level
- Patent number 6,795,657
- Issue date Sep 21, 2004
- NEC Corporation
- Masayuki Nakano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical transmitter
- Patent number 6,600,585
- Issue date Jul 29, 2003
- NEC Corporation
- Masayuki Nakano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Laser diode driving method and circuit
- Patent number 6,292,497
- Issue date Sep 18, 2001
- NEC Corporation
- Masayuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflector-provided dipole antenna
- Patent number 6,008,773
- Issue date Dec 28, 1999
- Nihon Dengyo Kosaku Co., Ltd.
- Tohru Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding of calcium silicate having high strength and its manufactur...
- Patent number 5,330,573
- Issue date Jul 19, 1994
- Onoda Cement Co., Ltd.
- Masayuki Nakano
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULATOR AND OPTICAL MODULATION METHOD
- Publication number 20240333391
- Publication date Oct 3, 2024
- NEC Corporation
- Masayuki NAKANO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL TRANSCEIVER, OPTICAL COMMUNICATION SYSTEM, AND METHOD FOR I...
- Publication number 20240048241
- Publication date Feb 8, 2024
- NEC Corporation
- Masayuki Nakano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF PRODUCING REFLECTIVE ELECTRODE FOR DEEP ULTRAVIOLET LIGHT...
- Publication number 20220123177
- Publication date Apr 21, 2022
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yasuhiro WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD, AND PROGRAM FOR MANAGING EVALUATION OF AVATAR IMAGES
- Publication number 20190147635
- Publication date May 16, 2019
- DeNA Co., Ltd.
- Masatoshi INAGAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Submount and Method of Manufacturing the Same
- Publication number 20120012373
- Publication date Jan 19, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DIODE AND METHOD OF PRODUCING THE SAME
- Publication number 20120007116
- Publication date Jan 12, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Masayuki Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DIODE AND METHOD OF PRODUCING THE SAME
- Publication number 20110316030
- Publication date Dec 29, 2011
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Hiroyuki Togawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER LAYER, HEAT SINK USING SUCH A SOLDER LAYER AND METHOD FOR MA...
- Publication number 20100263849
- Publication date Oct 21, 2010
- Masayuki Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Submount and Method of Manufacturing the Same
- Publication number 20090207580
- Publication date Aug 20, 2009
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER LAYER, SUBSTRATE FOR DEVICE JOINING UTILIZING THE SAME AND M...
- Publication number 20090095513
- Publication date Apr 16, 2009
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER LAYER AND DEVICE BONDING SUBSTRATE USING THE SAME AND METHOD...
- Publication number 20080205013
- Publication date Aug 28, 2008
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Yoshikazu OSHIKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER LAYER AND ELECTRONIC DEVICE BONDING SUBSTRATE AND SUBMOUNT U...
- Publication number 20070228105
- Publication date Oct 4, 2007
- Yoshikazu Oshika
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical module capable of facilitating release from locking state w...
- Publication number 20040228582
- Publication date Nov 18, 2004
- NEC Corporation
- Yasushi Yamada
- G02 - OPTICS

Masayuki Nakano

Person

Patents Grantslast 30 patents

System, method, and program for managing evaluation of avatar images

Semiconductor light emitting diode and method of producing the same

Semiconductor light emitting diode and method of producing the same

Solder layer and device bonding substrate using the same and method...

Submount

Solder layer, substrate for device joining utilizing the same and m...

Submount and method of manufacturing the same

Solder layer and electronic device bonding substrate and submount u...

Solder layer, heat sink using such a solder layer and method for ma...

Optical module with lever that abuts case to release latch from loc...

Circuit and method for monitoring optical signal level

Optical transmitter

Laser diode driving method and circuit

Reflector-provided dipole antenna

Molding of calcium silicate having high strength and its manufactur...

Patents Applicationslast 30 patents

OPTICAL MODULATOR AND OPTICAL MODULATION METHOD

OPTICAL TRANSCEIVER, OPTICAL COMMUNICATION SYSTEM, AND METHOD FOR I...

METHOD OF PRODUCING REFLECTIVE ELECTRODE FOR DEEP ULTRAVIOLET LIGHT...

SYSTEM, METHOD, AND PROGRAM FOR MANAGING EVALUATION OF AVATAR IMAGES

Submount and Method of Manufacturing the Same

SEMICONDUCTOR LIGHT EMITTING DIODE AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR LIGHT EMITTING DIODE AND METHOD OF PRODUCING THE SAME

SOLDER LAYER, HEAT SINK USING SUCH A SOLDER LAYER AND METHOD FOR MA...

Submount and Method of Manufacturing the Same

SOLDER LAYER, SUBSTRATE FOR DEVICE JOINING UTILIZING THE SAME AND M...

SOLDER LAYER AND DEVICE BONDING SUBSTRATE USING THE SAME AND METHOD...

SOLDER LAYER AND ELECTRONIC DEVICE BONDING SUBSTRATE AND SUBMOUNT U...

Optical module capable of facilitating release from locking state w...