Membership
Tour
Register
Log in
Masayuki Ochiai
Follow
Person
Kawasaki, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Method for manufacturing a printed circuit board for electronic dev...
Patent number
7,604,152
Issue date
Oct 20, 2009
Fujitsu Limited
Masayuki Ochiai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder paste and terminal-to-terminal connection structure
Patent number
6,867,378
Issue date
Mar 15, 2005
Fujitsu Limited
Hiroki Uchida
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of making semiconductor device
Patent number
6,689,639
Issue date
Feb 10, 2004
Fujitsu Limited
Seiki Sakuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder paste and electronic device
Patent number
6,596,094
Issue date
Jul 22, 2003
Fujitsu Limited
Masayuki Ochiai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bump-forming method using two plates and electronic device
Patent number
6,528,346
Issue date
Mar 4, 2003
Fujitsu Limited
Masayuki Ochiai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for forming solder bumps
Patent number
6,319,810
Issue date
Nov 20, 2001
Fujitsu Limited
Masayuki Ochiai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Defluxing agent cleaning method and cleaning apparatus
Patent number
6,140,286
Issue date
Oct 31, 2000
Fujitsu Limited
Keiji Watanabe
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Defluxing agent cleaning method and cleaning apparatus
Patent number
6,050,479
Issue date
Apr 18, 2000
Fujitsu, Ltd.
Keiji Watanabe
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for fabricating solder bumps by forming solder balls with a...
Patent number
6,025,258
Issue date
Feb 15, 2000
Fujitsu Limited
Masayuki Ochiai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for fabricating metal bumps onto electronic device
Patent number
5,959,346
Issue date
Sep 28, 1999
Fujitsu Limited
Masayuki Ochiai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cleaning method using a defluxing agent
Patent number
5,695,571
Issue date
Dec 9, 1997
Fujitsu Limited
Keiji Watanabe
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for forming solder balls on a plate having apertures using...
Patent number
5,643,831
Issue date
Jul 1, 1997
Fujitsu Limited
Masayuki Ochiai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods for making metal particle spherical and removing oxide film...
Patent number
5,616,164
Issue date
Apr 1, 1997
Fujitsu Limited
Masayuki Ochiai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for flip chip connecting a semiconductor chip
Patent number
5,284,796
Issue date
Feb 8, 1994
Fujitsu Limited
Teru Nakanishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for soldering electronic components onto a printed wiring bo...
Patent number
4,759,490
Issue date
Jul 26, 1988
Fujitsu Limited
Masayuki Ochiai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Method for manufacturing a printed circuit board for electronic dev...
Publication number
20070090171
Publication date
Apr 26, 2007
FUJITSU LIMITED
Masayuki Ochiai
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of making semiconductor device
Publication number
20030096494
Publication date
May 22, 2003
FUJITSU LIMITED
Seiki Sakuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder paste and terminal-to-terminal connection structure
Publication number
20030066681
Publication date
Apr 10, 2003
FUJITSU LIMITED
Hiroki Uchida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Solder paste and electronic device
Publication number
20020102432
Publication date
Aug 1, 2002
FUJITSU LIMITED
Masayuki Ochiai
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Solder alloy, a circuit substrate, a semiconductor device and a met...
Publication number
20010028109
Publication date
Oct 11, 2001
Kozo Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bump-forming method using two plates and electronic device
Publication number
20010018263
Publication date
Aug 30, 2001
Masayuki Ochiai
H01 - BASIC ELECTRIC ELEMENTS