Masayuki Sasaki

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayered substrate for semiconductor device and method of manuf...
- Patent number 7,763,809
- Issue date Jul 27, 2010
- Shink Electric Industries Co., Inc.
- Akio Rokugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated multilayered substrate having connecting leads for mounti...
- Patent number 6,931,724
- Issue date Aug 23, 2005
- Shinko Electric Industries Co., Ltd.
- Akio Rokugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making multilayer circuit board
- Patent number 6,640,429
- Issue date Nov 4, 2003
- Shinko Electric Industries Co., Ltd.
- Masayuki Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board-providing article, circuit board, semiconductor devic...
- Patent number 6,603,202
- Issue date Aug 5, 2003
- Shinko Electric Industries Co., Ltd.
- Masayuki Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board having a capacitor and process for manufac...
- Patent number 6,597,583
- Issue date Jul 22, 2003
- Shinko Electric Industries Co., Ltd.
- Masayuki Sasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin film capacitance device and printed circuit board
- Patent number 6,498,714
- Issue date Dec 24, 2002
- Shinko Electric Industries Co., Ltd.
- Akira Fujisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered substrate for semiconductor device
- Patent number 6,441,314
- Issue date Aug 27, 2002
- Shinko Electric Industries Co., Inc.
- Akio Rokugawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multilayered substrate for semiconductor device
- Patent number 6,418,615
- Issue date Jul 16, 2002
- Shinko Electronics Industries, Co., Ltd.
- Akio Rokugawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered wiring board, a production process for, and semiconduc...
- Patent number 6,410,858
- Issue date Jun 25, 2002
- Shinko Electric Industries Co. Ltd.
- Masayuki Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multilayer circuit, and semiconductor de...
- Patent number 5,994,771
- Issue date Nov 30, 1999
- Shinko Electric Industries Co., Inc.
- Masayuki Sasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multilayered substrate for semiconductor device and method of manuf...
- Publication number 20050017271
- Publication date Jan 27, 2005
- Shinko Electric Industries Co.,Inc.
- Akio Rokugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered substrate for semiconductor device
- Publication number 20020195272
- Publication date Dec 26, 2002
- Shinko Electric Industries Co., Ltd.
- Akio Rokugawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer circuit board having a capacitor and process for manufac...
- Publication number 20020084104
- Publication date Jul 4, 2002
- Masayuki Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED WIRING BOARD, A PRODUCTION PROCESS FOR, AND SEMICONDUC...
- Publication number 20020043399
- Publication date Apr 18, 2002
- Masayuki Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayered Substrate for Semiconductor Device
- Publication number 20010013425
- Publication date Aug 16, 2001
- Shinko Electric Industries Co., Ltd.
- Akio Rokugawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board-providing article, circuit board, semiconductor devic...
- Publication number 20010006119
- Publication date Jul 5, 2001
- Masayuki Sasaki
- H01 - BASIC ELECTRIC ELEMENTS

Masayuki Sasaki

Person

Patents Grantslast 30 patents

Multilayered substrate for semiconductor device and method of manuf...

Insulated multilayered substrate having connecting leads for mounti...

Method of making multilayer circuit board

Circuit board-providing article, circuit board, semiconductor devic...

Multilayer circuit board having a capacitor and process for manufac...

Thin film capacitance device and printed circuit board

Multilayered substrate for semiconductor device

Method of making multilayered substrate for semiconductor device

Multilayered wiring board, a production process for, and semiconduc...

Semiconductor package with multilayer circuit, and semiconductor de...

Patents Applicationslast 30 patents

Multilayered substrate for semiconductor device and method of manuf...

Multilayered substrate for semiconductor device

Multilayer circuit board having a capacitor and process for manufac...

MULTILAYERED WIRING BOARD, A PRODUCTION PROCESS FOR, AND SEMICONDUC...

Multilayered Substrate for Semiconductor Device

Circuit board-providing article, circuit board, semiconductor devic...