Masayuki Shimura

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus
- Patent number 6,070,780
- Issue date Jun 6, 2000
- Kabushiki Kaisha Shinkawa
- Masayuki Shimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire height inspection device
- Patent number 6,059,846
- Issue date May 9, 2000
- Kabushiki Kaisha Shinkawa
- Hisashi Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for detecting errors in top/bottom/front/back orientation of...
- Patent number 5,208,464
- Issue date May 4, 1993
- Kabushiki Kaisha Shinkawa
- Michio Yonemoto
- H01 - BASIC ELECTRIC ELEMENTS