Masayuki Yamada

Follow

Person

Shirakawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method and equipment therefor
- Patent number 5,882,539
- Issue date Mar 16, 1999
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for chamfering the peripheral edge of a wafer...
- Patent number 5,514,025
- Issue date May 7, 1996
- Shin-Etsu Handotai Co. Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing chamfers of a wafer
- Patent number 5,317,836
- Issue date Jun 7, 1994
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and an apparatus for polishing wafer chamfers
- Patent number 5,316,620
- Issue date May 31, 1994
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B24 - GRINDING POLISHING
Information Patent Grant
Scrubber apparatus for cleaning a thin disk work
- Patent number 5,282,289
- Issue date Feb 1, 1994
- Shin-Etsu Handotai Co., Ltd.
- Fumihiko Hasegawa
- B08 - CLEANING