Masazumi Amagai

Person

Hayami-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating flip-attached and underfilled semiconductor...
- Patent number 8,598,029
- Issue date Dec 3, 2013
- Texas Instruments Incorporated
- Masako Watanabe
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device having multiple semiconductor elements
- Patent number 8,304,883
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Yoshimi Takahashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating flip-attached and underfilled semiconductor...
- Patent number 8,193,085
- Issue date Jun 5, 2012
- Texas Instruments Incorporated
- Masako Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC having TSV arrays with reduced TSV induced stress
- Patent number 8,097,964
- Issue date Jan 17, 2012
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,971,351
- Issue date Jul 5, 2011
- Texas Instruments Incorporated
- Yoshimi Takahashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device with an improved solder joint
- Patent number 7,884,009
- Issue date Feb 8, 2011
- Texas Instruments Incorporated
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with an improved solder joint
- Patent number 7,786,599
- Issue date Aug 31, 2010
- Texas Instruments Incorporated
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating flip-attached and underfilled semiconductor...
- Patent number 7,701,071
- Issue date Apr 20, 2010
- Texas Instruments Incorporated
- Masako Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductive device having improved copper density for package-on...
- Patent number 7,679,002
- Issue date Mar 16, 2010
- Texas Instruments Incorporated
- Masazumi Amagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an improved solder joint
- Patent number 7,626,274
- Issue date Dec 1, 2009
- Texas Instruments Incorporated
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,520,052
- Issue date Apr 21, 2009
- Texas Instruments Incorporated
- Yoshimi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder
- Patent number 7,282,175
- Issue date Oct 16, 2007
- Senju Metal Industry Co., Ltd.
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct attachment of semiconductor chip to organic substrate
- Patent number 7,042,070
- Issue date May 9, 2006
- Texas Instruments Incorporated
- Chee Kiang Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder alloy
- Patent number 7,029,542
- Issue date Apr 18, 2006
- Senju Metal Industry Co., Ltd.
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with metal foil attachment film
- Patent number 6,873,059
- Issue date Mar 29, 2005
- Texas Instruments Incorporated
- Masazumi Amagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a semiconductor wafer and heat sink into individua...
- Patent number 6,784,022
- Issue date Aug 31, 2004
- Texas Instruments Incorporated
- Norito Umehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of semiconductor device and wiring substrate
- Patent number 6,762,506
- Issue date Jul 13, 2004
- Texas Instruments Incorporated
- Masazumi Amagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead over chip semiconductor device including a heat sink for heat...
- Patent number 6,713,851
- Issue date Mar 30, 2004
- Texas Instruments Incorporated
- Norito Umehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct attachment semiconductor chip to organic substrate
- Patent number 6,602,803
- Issue date Aug 5, 2003
- Texas Instruments Incorporated
- Chee Kiang Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preparing a semiconductor wafer
- Patent number 6,297,076
- Issue date Oct 2, 2001
- Lintec Corporation
- Masazumi Amagai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device in BGA package and manufacturing method thereof
- Patent number 6,232,661
- Issue date May 15, 2001
- Texas Instruments Incorporated
- Masazumi Amagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 6,144,102
- Issue date Nov 7, 2000
- Texas Instruments Incorporated
- Masazumi Amagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, and insulating...
- Patent number 6,118,183
- Issue date Sep 12, 2000
- Texas Instruments Incorporated
- Norito Umehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing/bonding sheet and process for producing semiconductor...
- Patent number 6,007,920
- Issue date Dec 28, 1999
- Texas Instruments Japan, Ltd.
- Norito Umehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a tapeless mounting
- Patent number 5,986,335
- Issue date Nov 16, 1999
- Texas Instruments Incorporated
- Masazumi Amagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, its manufacturing method, and dicing adhesive...
- Patent number 5,960,260
- Issue date Sep 28, 1999
- Texas Instruments Incorporated
- Norito Umehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor device
- Patent number 5,882,956
- Issue date Mar 16, 1999
- Texas Instruments Japan Ltd.
- Norito Umehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having stress absorbing film
- Patent number 5,466,888
- Issue date Nov 14, 1995
- Hitachi, Ltd.
- Lim T. Beng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having stress absorbing film
- Patent number 5,406,028
- Issue date Apr 11, 1995
- Hitachi, Ltd.
- Lim T. Beng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Fabricating Flip-Attached and Underfilled Semiconductor...
- Publication number 20120220080
- Publication date Aug 30, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Masako Watanabe
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Method of Manufacturing a Semiconductor Device
- Publication number 20110254150
- Publication date Oct 20, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Yoshimi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE FOR CAVITY PACKAGE
- Publication number 20110024899
- Publication date Feb 3, 2011
- Kenji MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with an Improved Solder Joint
- Publication number 20100291734
- Publication date Nov 18, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Masazumi AMAGAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC HAVING TSV ARRAYS WITH REDUCED TSV INDUCED STRESS
- Publication number 20100171226
- Publication date Jul 8, 2010
- Texas Instruments, Inc.
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating Flip-Attached and Underfilled Semiconductor...
- Publication number 20100144098
- Publication date Jun 10, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Masako WATANABE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
COMPOSITE TYPE SEMICONDUCTOR DEVICE SPACER SHEET, SEMICONDUCTOR PAC...
- Publication number 20100090323
- Publication date Apr 15, 2010
- Lintec Corporation
- Tomonori Shinoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with an Improved Solder Joint
- Publication number 20100032840
- Publication date Feb 11, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Masazumi AMAGAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SPACER SH...
- Publication number 20100025837
- Publication date Feb 4, 2010
- LINTEC CORPORATION
- Tomonori Shinoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device
- Publication number 20090176336
- Publication date Jul 9, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Yoshimi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Control of Standoff Height Between Packages with a Solder-Embedded...
- Publication number 20080157353
- Publication date Jul 3, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Masako Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductive Device Having Improved Copper Density for Package-on...
- Publication number 20080048303
- Publication date Feb 28, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Masazumi Amagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-Free Solder
- Publication number 20070243098
- Publication date Oct 18, 2007
- Tsukasa Ohnishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with an improved solder joint
- Publication number 20070182006
- Publication date Aug 9, 2007
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-attached and underfilled stacked semiconductor devices
- Publication number 20070170599
- Publication date Jul 26, 2007
- Masazumi Amagai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device and Method of Manufacturing a Semiconductor De...
- Publication number 20060292753
- Publication date Dec 28, 2006
- Yoshimi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating flip-attached an underfilled semiconductor d...
- Publication number 20060214314
- Publication date Sep 28, 2006
- Masako Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Copper-based chip attach for chip-scale semiconductor packages
- Publication number 20050127498
- Publication date Jun 16, 2005
- Masazumi Amagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-free solder alloy
- Publication number 20050036902
- Publication date Feb 17, 2005
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-free solder
- Publication number 20040262779
- Publication date Dec 30, 2004
- Masazumi Amagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct attachment of semiconductor chip to organic substrate
- Publication number 20040004283
- Publication date Jan 8, 2004
- Chee Kiang Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly of semiconductor device and wiring substrate
- Publication number 20030173587
- Publication date Sep 18, 2003
- Masazumi Amagai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and mounting method
- Publication number 20030132520
- Publication date Jul 17, 2003
- Masako Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Copper-based chip attach for chip-scale semiconductor packages
- Publication number 20030092215
- Publication date May 15, 2003
- Masazumi Amagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and its manufacturing method
- Publication number 20020158331
- Publication date Oct 31, 2002
- Norito Umehara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT ATTACHMENT SEMICONDUCTOR CHIP TO ORGANIC SUBSTRATE
- Publication number 20020130397
- Publication date Sep 19, 2002
- CHEE KIANG YEW
- H01 - BASIC ELECTRIC ELEMENTS

Masazumi Amagai

Person

Patents Grantslast 30 patents

Method for fabricating flip-attached and underfilled semiconductor...

Semiconductor device having multiple semiconductor elements

Method for fabricating flip-attached and underfilled semiconductor...

IC having TSV arrays with reduced TSV induced stress

Method of manufacturing a semiconductor device

Semiconductor device with an improved solder joint

Semiconductor device with an improved solder joint

Method for fabricating flip-attached and underfilled semiconductor...

Semiconductive device having improved copper density for package-on...

Semiconductor device with an improved solder joint

Method of manufacturing a semiconductor device

Lead-free solder

Direct attachment of semiconductor chip to organic substrate

Lead-free solder alloy

Semiconductor package with metal foil attachment film

Method of dicing a semiconductor wafer and heat sink into individua...

Assembly of semiconductor device and wiring substrate

Lead over chip semiconductor device including a heat sink for heat...

Direct attachment semiconductor chip to organic substrate

Process for preparing a semiconductor wafer

Semiconductor device in BGA package and manufacturing method thereof

Semiconductor device package

Semiconductor device, manufacturing method thereof, and insulating...

Wafer dicing/bonding sheet and process for producing semiconductor...

Semiconductor device having a tapeless mounting

Semiconductor device, its manufacturing method, and dicing adhesive...

Process for producing semiconductor device

Packaged semiconductor device having stress absorbing film

Packaged semiconductor device having stress absorbing film

Patents Applicationslast 30 patents

Method for Fabricating Flip-Attached and Underfilled Semiconductor...

Method of Manufacturing a Semiconductor Device

SUBSTRATE STRUCTURE FOR CAVITY PACKAGE

Semiconductor Device with an Improved Solder Joint

IC HAVING TSV ARRAYS WITH REDUCED TSV INDUCED STRESS

Method for Fabricating Flip-Attached and Underfilled Semiconductor...

COMPOSITE TYPE SEMICONDUCTOR DEVICE SPACER SHEET, SEMICONDUCTOR PAC...

Semiconductor Device with an Improved Solder Joint

COMPOSITE SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND SPACER SH...

Method of Manufacturing a Semiconductor Device

Control of Standoff Height Between Packages with a Solder-Embedded...

Semiconductive Device Having Improved Copper Density for Package-on...

Lead-Free Solder

Semiconductor device with an improved solder joint

Flip-attached and underfilled stacked semiconductor devices

Semiconductor Device and Method of Manufacturing a Semiconductor De...

Method for fabricating flip-attached an underfilled semiconductor d...

Copper-based chip attach for chip-scale semiconductor packages

Lead-free solder alloy

Lead-free solder

Direct attachment of semiconductor chip to organic substrate

Assembly of semiconductor device and wiring substrate

Semiconductor device and mounting method

Copper-based chip attach for chip-scale semiconductor packages

Semiconductor device and its manufacturing method

DIRECT ATTACHMENT SEMICONDUCTOR CHIP TO ORGANIC SUBSTRATE