Masood Murtuza

Person

Sugarland, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Secure enclave system-in-package
- Patent number 12,001,363
- Issue date Jun 4, 2024
- OCTAVO SYSTEMS LLC
- Peter Robert Linder
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System in a package modifications
- Patent number 11,869,823
- Issue date Jan 9, 2024
- OCTAVO SYSTEMS LLC
- Michael Kenneth Conti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance module for SiP
- Patent number 11,610,844
- Issue date Mar 21, 2023
- OCTAVO SYSTEMS LLC
- Gene Alan Frantz
- G11 - INFORMATION STORAGE
Information Patent Grant
System and method of assembling a system
- Patent number 11,502,030
- Issue date Nov 15, 2022
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shield for molded packages
- Patent number 11,302,648
- Issue date Apr 12, 2022
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in a package connectors
- Patent number 11,257,803
- Issue date Feb 22, 2022
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Service module for SIP devices
- Patent number 11,211,369
- Issue date Dec 28, 2021
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Configurable substrate and systems
- Patent number 11,171,126
- Issue date Nov 9, 2021
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for routing bond wires in system in a package (SiP) devices
- Patent number 11,157,676
- Issue date Oct 26, 2021
- OCTAVO SYSTEMS LLC
- Neeraj Kumar Reddy Dantu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit mounting structure and lead frame for system in package (SI...
- Patent number 10,867,979
- Issue date Dec 15, 2020
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shield for molded packages
- Patent number 10,714,430
- Issue date Jul 14, 2020
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for system in package (SIP) devices
- Patent number 10,204,890
- Issue date Feb 12, 2019
- Octavo Systems LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture for test circuit board reliability testing
- Patent number 9,354,138
- Issue date May 31, 2016
- Texas Instruments Incorporated
- Anthony B. Murphy
- G01 - MEASURING TESTING
Information Patent Grant
Method for contacting agglomerate terminals of semiconductor packages
- Patent number 8,716,068
- Issue date May 6, 2014
- Texas Instruments Incorporated
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having agglomerate terminals
- Patent number 8,643,165
- Issue date Feb 4, 2014
- Texas Instruments Incorporated
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having low resistance TSV comprising ground connection
- Patent number 8,436,475
- Issue date May 7, 2013
- Texas Instruments Incorporated
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having low resistance TSV comprising ground connection
- Patent number 8,431,481
- Issue date Apr 30, 2013
- Texas Instruments Incorporated
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC device having low resistance TSV comprising ground connection
- Patent number 8,178,976
- Issue date May 15, 2012
- Texas Instruments Incorporated
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic devices with face-up die having TSV connection...
- Patent number 8,154,134
- Issue date Apr 10, 2012
- Texas Instruments Incorporated
- Thomas D. Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for post-circuitization assembly
- Patent number 8,039,309
- Issue date Oct 18, 2011
- Texas Instruments Incorporated
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual carrier for joining IC die or wafers to TSV wafers
- Patent number 8,017,439
- Issue date Sep 13, 2011
- Texas Instruments Incorporated
- Yoshimi Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding IC die to TSV wafers
- Patent number 7,915,080
- Issue date Mar 29, 2011
- Texas Instruments Incorporated
- Yoshimi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi layer low cost cavity substrate fabrication for PoP packages
- Patent number 7,883,936
- Issue date Feb 8, 2011
- Texas Instruments Incorporated
- Prema Palaniappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder cap application process on copper bump using solder powder film
- Patent number 7,790,597
- Issue date Sep 7, 2010
- Texas Instruments Incorporated
- Satyendra S. Chauhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support structure for low-k dielectrics
- Patent number 7,642,649
- Issue date Jan 5, 2010
- Texas Instruments Incorporated
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi layer low cost cavity substrate fabrication for pop packages
- Patent number 7,635,914
- Issue date Dec 22, 2009
- Texas Instruments Incorporated
- Prema Palaniappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip
- Patent number 7,445,960
- Issue date Nov 4, 2008
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch low cost flip chip substrate
- Patent number 7,323,405
- Issue date Jan 29, 2008
- Texas Instruments Incorporated
- Satyendra S. Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip
- Patent number 7,319,275
- Issue date Jan 15, 2008
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion by plasma conditioning of semiconductor chip surfaces
- Patent number 7,276,401
- Issue date Oct 2, 2007
- Texas Instruments Incorporated
- Marvin W. Cowens
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SECURE ENCLAVE SYSTEM-IN-PACKAGE
- Publication number 20240289290
- Publication date Aug 29, 2024
- Octavo Systems LLC
- Peter Robert LINDER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM IN A PACKAGE (SIP) THERMAL MANAGEMENT
- Publication number 20240266243
- Publication date Aug 8, 2024
- Octavo Systems LLC
- Eshtaartha BASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN A PACKAGE MODIFICATIONS
- Publication number 20240087975
- Publication date Mar 14, 2024
- Octavo Systems LLC
- Michael Kenneth CONTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE ENCLAVE SYSTEM-IN-PACKAGE
- Publication number 20230185748
- Publication date Jun 15, 2023
- Octavo Systems LLC
- Peter Robert LINDER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOLDED PACKAGES IN A MOLDED DEVICE
- Publication number 20220028704
- Publication date Jan 27, 2022
- Octavo Systems LLC
- Masood MURTUZA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM IN A PACKAGE MODIFICATIONS
- Publication number 20210143075
- Publication date May 13, 2021
- Octavo Systems LLC
- Michael Kenneth CONTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI SHIELD FOR MOLDED PACKAGES
- Publication number 20200303321
- Publication date Sep 24, 2020
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MODULE FOR SIP
- Publication number 20200243451
- Publication date Jul 30, 2020
- Octavo Systems LLC
- Gene Alan FRANTZ
- G11 - INFORMATION STORAGE
Information Patent Application
SYSTEM IN A PACKAGE CONNECTORS
- Publication number 20200066702
- Publication date Feb 27, 2020
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ROUTING BOND WIRES IN SYSTEM IN A PACKAGE (SIP) DEVICES
- Publication number 20190347378
- Publication date Nov 14, 2019
- Octavo Systems LLC
- Neeraj Kumar Reddy DANTU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SERVICE MODULE FOR SIP DEVICES
- Publication number 20190273073
- Publication date Sep 5, 2019
- Octavo Systems LLC
- Masood MURTUZA
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE FOR USE IN SYSTEM IN A PACKAGE (SIP) DEVICES
- Publication number 20190206779
- Publication date Jul 4, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR SYSTEM IN PACKAGING (SIP) DEVICES
- Publication number 20190115331
- Publication date Apr 18, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED SYSTEM USING SYSTEM IN PACKAGE COMPONENTS
- Publication number 20190074268
- Publication date Mar 7, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI SHIELD FOR MOLDED PACKAGES
- Publication number 20190027443
- Publication date Jan 24, 2019
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS
- Publication number 20180321313
- Publication date Nov 8, 2018
- Octavo Systems LLC
- Kevin Michael Troy
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
IMPROVED SUBSTRATE FOR SYSTEM IN PACKAGE (SIP) DEVICES
- Publication number 20170287885
- Publication date Oct 5, 2017
- Octavo Systems LLC
- Masood MURTUZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING ELECTRONIC DEVICES
- Publication number 20170221871
- Publication date Aug 3, 2017
- Octavo Systems LLC
- Gregory Michael Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE FOR TEST CIRCUIT BOARD RELIABILITY TESTING
- Publication number 20150007662
- Publication date Jan 8, 2015
- TEXAS INSTRUMENTS INCORPORATED
- ANTHONY B. MURPHY
- G01 - MEASURING TESTING
Information Patent Application
LEADFRAME WITH LEAD OF VARYING THICKNESS
- Publication number 20140367838
- Publication date Dec 18, 2014
- Donald Charles Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES
- Publication number 20140038358
- Publication date Feb 6, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES
- Publication number 20120211889
- Publication date Aug 23, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Darvin R. EDWARDS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Device Having Low Resistance TSV Comprising Ground Connection
- Publication number 20120202321
- Publication date Aug 9, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC Device Having Low Resistance TSV Comprising Ground Connection
- Publication number 20120193814
- Publication date Aug 2, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Rajiv Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CARRIER FOR JOINING IC DIE OR WAFERS TO TSV WAFERS
- Publication number 20110183464
- Publication date Jul 28, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Yoshimi Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING IC DIE TO TSV WAFERS
- Publication number 20100159643
- Publication date Jun 24, 2010
- TEXAS INSTRUMENTS INCORPORATED
- YOSHIMI TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi Layer Low Cost Cavity Substrate Fabrication for POP Packages
- Publication number 20100062567
- Publication date Mar 11, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Prema Palaniappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Reliable Solder Joints
- Publication number 20090297879
- Publication date Dec 3, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kejun ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED ELECTRONIC DEVICES WITH FACE-UP DIE HAVING TSV CONNECTION...
- Publication number 20090278245
- Publication date Nov 12, 2009
- Texas Instruments Inc.
- THOMAS D. BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE HAVING LOW RESISTANCE TSV COMPRISING GROUND CONNECTION
- Publication number 20090278244
- Publication date Nov 12, 2009
- Texas Instruments Inc.
- RAJIV DUNNE
- H01 - BASIC ELECTRIC ELEMENTS

Masood Murtuza

Person

Patents Grantslast 30 patents

Secure enclave system-in-package

System in a package modifications

High performance module for SiP

System and method of assembling a system

EMI shield for molded packages

System in a package connectors

Service module for SIP devices

Configurable substrate and systems

Method for routing bond wires in system in a package (SiP) devices

Circuit mounting structure and lead frame for system in package (SI...

EMI shield for molded packages

Substrate for system in package (SIP) devices

Fixture for test circuit board reliability testing

Method for contacting agglomerate terminals of semiconductor packages

Semiconductor device having agglomerate terminals

IC device having low resistance TSV comprising ground connection

IC device having low resistance TSV comprising ground connection

IC device having low resistance TSV comprising ground connection

Packaged electronic devices with face-up die having TSV connection...

Systems and methods for post-circuitization assembly

Dual carrier for joining IC die or wafers to TSV wafers

Bonding IC die to TSV wafers

Multi layer low cost cavity substrate fabrication for PoP packages

Solder cap application process on copper bump using solder powder film

Support structure for low-k dielectrics

Multi layer low cost cavity substrate fabrication for pop packages

Adhesion by plasma conditioning of semiconductor chip

Fine pitch low cost flip chip substrate

Adhesion by plasma conditioning of semiconductor chip

Adhesion by plasma conditioning of semiconductor chip surfaces

Patents Applicationslast 30 patents

SECURE ENCLAVE SYSTEM-IN-PACKAGE

SYSTEM IN A PACKAGE (SIP) THERMAL MANAGEMENT

SYSTEM IN A PACKAGE MODIFICATIONS

SECURE ENCLAVE SYSTEM-IN-PACKAGE

MOLDED PACKAGES IN A MOLDED DEVICE

SYSTEM IN A PACKAGE MODIFICATIONS

EMI SHIELD FOR MOLDED PACKAGES

HIGH PERFORMANCE MODULE FOR SIP

SYSTEM IN A PACKAGE CONNECTORS

METHOD FOR ROUTING BOND WIRES IN SYSTEM IN A PACKAGE (SIP) DEVICES

SERVICE MODULE FOR SIP DEVICES

SUBSTRATE FOR USE IN SYSTEM IN A PACKAGE (SIP) DEVICES

SUBSTRATE FOR SYSTEM IN PACKAGING (SIP) DEVICES

IMPROVED SYSTEM USING SYSTEM IN PACKAGE COMPONENTS

EMI SHIELD FOR MOLDED PACKAGES

COMPONENT COMMUNICATIONS IN SYSTEM-IN-PACKAGE SYSTEMS

IMPROVED SUBSTRATE FOR SYSTEM IN PACKAGE (SIP) DEVICES

SYSTEMS AND METHODS FOR MANUFACTURING ELECTRONIC DEVICES

FIXTURE FOR TEST CIRCUIT BOARD RELIABILITY TESTING

LEADFRAME WITH LEAD OF VARYING THICKNESS

METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES

METHOD FOR CONTACTING AGGLOMERATE TERMINALS OF SEMICONDUCTOR PACKAGES

IC Device Having Low Resistance TSV Comprising Ground Connection

IC Device Having Low Resistance TSV Comprising Ground Connection

DUAL CARRIER FOR JOINING IC DIE OR WAFERS TO TSV WAFERS

BONDING IC DIE TO TSV WAFERS

Multi Layer Low Cost Cavity Substrate Fabrication for POP Packages

Structure and Method for Reliable Solder Joints

PACKAGED ELECTRONIC DEVICES WITH FACE-UP DIE HAVING TSV CONNECTION...

IC DEVICE HAVING LOW RESISTANCE TSV COMPRISING GROUND CONNECTION