Masuaki Okada

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,651,363
- Issue date Feb 18, 2014
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,091,764
- Issue date Jan 10, 2012
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 7,784,670
- Issue date Aug 31, 2010
- Bondtech Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method, device produced by this method, and bonding device
- Patent number 7,645,681
- Issue date Jan 12, 2010
- Bondtech, Inc.
- Masuaki Okada
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20120104076
- Publication date May 3, 2012
- TADATOMO SUGA
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20100252615
- Publication date Oct 7, 2010
- Bondtech, Inc
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining Method and Device Produced by this Method and Joining Unit
- Publication number 20080245843
- Publication date Oct 9, 2008
- BONDTECH INC.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding method, device formed by such method, surface activating un...
- Publication number 20070110917
- Publication date May 17, 2007
- Bondtech, Inc
- Masuaki Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method, device produced by this method, and bonding device
- Publication number 20070111471
- Publication date May 17, 2007
- Bondtech, Inc
- Masuaki Okada
- B81 - MICRO-STRUCTURAL TECHNOLOGY