Masuhiro Izumida

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Aizuwakamatsu, JP

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Patents Grantslast 30 patents

Information Patent Grant
Copper alloy lead material for leads of a semiconductor device
- Patent number 4,668,471
- Issue date May 26, 1987
- Mitsubishi Shindoh Co., Ltd.
- Rensei Futatsuka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...