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Mat J. Manusharow
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Phoenix, AZ, US
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last 30 patents
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Patent Grant
Integrated circuit package having bottom-side stiffener
Patent number
8,952,511
Issue date
Feb 10, 2015
Intel Corporation
Ajit V. Sathe
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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last 30 patents
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Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING BOTTOM-SIDE STIFFENER
Publication number
20090152738
Publication date
Jun 18, 2009
Ajit V. Sathe
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...