Mathew J. Manusharow

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 12,094,827
- Issue date Sep 17, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 12,051,651
- Issue date Jul 30, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 12,002,745
- Issue date Jun 4, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 11,961,804
- Issue date Apr 16, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines with stacked dielect...
- Patent number 11,791,528
- Issue date Oct 17, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Size and efficiency of dies
- Patent number 11,715,695
- Issue date Aug 1, 2023
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated thin film capacitors on a glass core substrate
- Patent number 11,688,729
- Issue date Jun 27, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,664,320
- Issue date May 30, 2023
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Helical plated through-hole package inductor
- Patent number 11,608,564
- Issue date Mar 21, 2023
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and system with package stiffening magnetic inductor core...
- Patent number 11,527,489
- Issue date Dec 13, 2022
- Intel Corporation
- Michael J. Hill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure having substrate thermal vent structures for indu...
- Patent number 11,437,346
- Issue date Sep 6, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines having l-shaped cros...
- Patent number 11,329,358
- Issue date May 10, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance integrated RF passives using dual lithography process
- Patent number 11,227,825
- Issue date Jan 18, 2022
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 11,158,578
- Issue date Oct 26, 2021
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an inductor
- Patent number 10,998,120
- Issue date May 4, 2021
- Intel Corporation
- William J. Lambert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Package power delivery using plane and shaped vias
- Patent number 10,971,416
- Issue date Apr 6, 2021
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Improving size and efficiency of dies
- Patent number 10,886,228
- Issue date Jan 5, 2021
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power-delivery methods for embedded multi-die interconnect bridges...
- Patent number 10,847,467
- Issue date Nov 24, 2020
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rlink—die to die channel interconnect configurations to improve sig...
- Patent number 10,784,204
- Issue date Sep 22, 2020
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate conductor structure and method
- Patent number 10,734,282
- Issue date Aug 4, 2020
- Intel Corporation
- Harold Ryan Chase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device including a transmission line associated with one o...
- Patent number 10,651,525
- Issue date May 12, 2020
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate
- Patent number 10,522,455
- Issue date Dec 31, 2019
- Intel Corporation
- Mathew J. Manusharow
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power-delivery methods for embedded multi-die interconnect bridges...
- Patent number 10,490,503
- Issue date Nov 26, 2019
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microprocessor package with first level die bump ground webbing str...
- Patent number 10,453,795
- Issue date Oct 22, 2019
- Intel Corporation
- Yu Amos Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 10,446,499
- Issue date Oct 15, 2019
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package power delivery using plane and shaped vias
- Patent number 10,410,939
- Issue date Sep 10, 2019
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor formed in substrate
- Patent number 10,312,007
- Issue date Jun 4, 2019
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate
- Patent number 10,242,942
- Issue date Mar 26, 2019
- Intel Corporation
- Mathew J. Manusharow
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20240421098
- Publication date Dec 19, 2024
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVING SIZE AND EFFICIENCY OF DIES
- Publication number 20240413089
- Publication date Dec 12, 2024
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIZE AND EFFICIENCY OF DIES
- Publication number 20230343714
- Publication date Oct 26, 2023
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIZE AND EFFICIENCY OF DIES
- Publication number 20230307373
- Publication date Sep 28, 2023
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20230253337
- Publication date Aug 10, 2023
- Tahoe Research, Ltd.
- Mihir K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS
- Publication number 20220231394
- Publication date Jul 21, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIZE AND EFFICIENCY OF DIES
- Publication number 20220115326
- Publication date Apr 14, 2022
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS
- Publication number 20220102261
- Publication date Mar 31, 2022
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE INDUCTORS IN INTERPOSER
- Publication number 20220093536
- Publication date Mar 24, 2022
- Intel Corporation
- Krishna BHARATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20220028790
- Publication date Jan 27, 2022
- Intel Corporation
- MIHIR K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELICAL PLATED THROUGH-HOLE PACKAGE INDUCTOR
- Publication number 20210304952
- Publication date Sep 30, 2021
- Intel Corporation
- William J. Lambert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SIZE AND EFFICIENCY OF DIES
- Publication number 20210043572
- Publication date Feb 11, 2021
- Intel Corporation
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS
- Publication number 20200235449
- Publication date Jul 23, 2020
- Intel Corporation
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECT DEVICE AND METHOD
- Publication number 20200111745
- Publication date Apr 9, 2020
- Intel Corporation
- MIHIR K. ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RLINK - DIE TO DIE CHANNEL INTERCONNECT CONFIGURATIONS TO IMPROVE S...
- Publication number 20200066641
- Publication date Feb 27, 2020
- Intel Corporation
- Kemal AYGUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-DELIVERY METHODS FOR EMBEDDED MULTI-DIE INTERCONNECT BRIDGES...
- Publication number 20200051916
- Publication date Feb 13, 2020
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED THIN FILM CAPACITORS ON A GLASS CORE SUBSTRATE
- Publication number 20200013770
- Publication date Jan 9, 2020
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STIFFENING MAGNETIC CORE
- Publication number 20200006250
- Publication date Jan 2, 2020
- Intel Corporation
- Michael J. Hill
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE HAVING SUBSTRATE THERMAL VENT STRUCTURES FOR INDU...
- Publication number 20200006287
- Publication date Jan 2, 2020
- Intel Corporation
- Michael J. HILL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20200006166
- Publication date Jan 2, 2020
- Intel Corporation
- Digvijay Raorane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE POWER DELIVERY USING PLANE AND SHAPED VIAS
- Publication number 20190355636
- Publication date Nov 21, 2019
- Intel Corporation
- Krishna BHARATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER-DELIVERY METHODS FOR EMBEDDED MULTI-DIE INTERCONNECT BRIDGES...
- Publication number 20190304911
- Publication date Oct 3, 2019
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUBSTRATE
- Publication number 20190164881
- Publication date May 30, 2019
- Intel Corporation
- Mathew J. MANUSHAROW
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HELICAL PLATED THROUGH-HOLE PACKAGE INDUCTOR
- Publication number 20190051447
- Publication date Feb 14, 2019
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CONDUCTOR STRUCTURE AND METHOD
- Publication number 20190027405
- Publication date Jan 24, 2019
- Intel Corporation
- Harold Ryan Chase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIZE AND EFFICIENCY OF DIES
- Publication number 20180331042
- Publication date Nov 15, 2018
- Mathew J. Manusharow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED PACKAGE POWER DELIVERY USING PLANE AND SHAPED VIAS
- Publication number 20180331003
- Publication date Nov 15, 2018
- Intel Corporation
- Krishna BHARATH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPROCESSOR PACKAGE WITH FIRST LEVEL DIE BUMP GROUND WEBBING STR...
- Publication number 20180331035
- Publication date Nov 15, 2018
- Yu Amos ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICALLY EMBEDDED PASSIVE COMPONENTS
- Publication number 20180332708
- Publication date Nov 15, 2018
- Intel Corporation
- William J. LAMBERT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED VOLTAGE REGULATOR WITH AUGMENTED CURRENT SOURCE
- Publication number 20180323708
- Publication date Nov 8, 2018
- Intel Corporation
- William J. LAMBERT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Mathew J. Manusharow

Person

Patents Grantslast 30 patents

Magnetic core inductors in interposer

Size and efficiency of dies

High density interconnect device and method

Size and efficiency of dies

High performance integrated RF passives using dual lithography process

Size and efficiency of dies

Low loss and low cross talk transmission lines with stacked dielect...

Size and efficiency of dies

Integrated thin film capacitors on a glass core substrate

High density interconnect device and method

Helical plated through-hole package inductor

Apparatus and system with package stiffening magnetic inductor core...

Package structure having substrate thermal vent structures for indu...

Low loss and low cross talk transmission lines having l-shaped cros...

High performance integrated RF passives using dual lithography process

High density interconnect device and method

Method of making an inductor

Package power delivery using plane and shaped vias

Improving size and efficiency of dies

Power-delivery methods for embedded multi-die interconnect bridges...

Rlink—die to die channel interconnect configurations to improve sig...

Substrate conductor structure and method

Packaged device including a transmission line associated with one o...

Integrated circuit package substrate

Power-delivery methods for embedded multi-die interconnect bridges...

Microprocessor package with first level die bump ground webbing str...

High density interconnect device and method

Package power delivery using plane and shaped vias

Inductor formed in substrate

Integrated circuit package substrate

Patents Applicationslast 30 patents

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

IMPROVING SIZE AND EFFICIENCY OF DIES

SIZE AND EFFICIENCY OF DIES

SIZE AND EFFICIENCY OF DIES

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS

SIZE AND EFFICIENCY OF DIES

HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS

MAGNETIC CORE INDUCTORS IN INTERPOSER

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

HELICAL PLATED THROUGH-HOLE PACKAGE INDUCTOR

SIZE AND EFFICIENCY OF DIES

LOW LOSS AND LOW CROSS TALK TRANSMISSION LINES USING SHAPED VIAS

HIGH DENSITY INTERCONNECT DEVICE AND METHOD

RLINK - DIE TO DIE CHANNEL INTERCONNECT CONFIGURATIONS TO IMPROVE S...

POWER-DELIVERY METHODS FOR EMBEDDED MULTI-DIE INTERCONNECT BRIDGES...

INTEGRATED THIN FILM CAPACITORS ON A GLASS CORE SUBSTRATE

PACKAGE STIFFENING MAGNETIC CORE

PACKAGE STRUCTURE HAVING SUBSTRATE THERMAL VENT STRUCTURES FOR INDU...

MICROELECTRONIC ASSEMBLIES

PACKAGE POWER DELIVERY USING PLANE AND SHAPED VIAS

POWER-DELIVERY METHODS FOR EMBEDDED MULTI-DIE INTERCONNECT BRIDGES...

INTEGRATED CIRCUIT PACKAGE SUBSTRATE

HELICAL PLATED THROUGH-HOLE PACKAGE INDUCTOR

SUBSTRATE CONDUCTOR STRUCTURE AND METHOD

SIZE AND EFFICIENCY OF DIES

IMPROVED PACKAGE POWER DELIVERY USING PLANE AND SHAPED VIAS

MICROPROCESSOR PACKAGE WITH FIRST LEVEL DIE BUMP GROUND WEBBING STR...

VERTICALLY EMBEDDED PASSIVE COMPONENTS

INTEGRATED VOLTAGE REGULATOR WITH AUGMENTED CURRENT SOURCE