Mathias KAEMPF

Person

Burglengenfeld, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Radiation-emitting semiconductor chip, method for producing a plura...
- Patent number 10,276,748
- Issue date Apr 30, 2019
- Osram Opto Semiconductors GmbH
- Mathias Kaempf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dividing a composite into semiconductor chips, and semic...
- Patent number 10,232,471
- Issue date Mar 19, 2019
- Osram Opto Semiconductors GmbH
- Mathias Kaempf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optoelectronic semiconductor chip, optoelectronic component and met...
- Patent number 10,115,869
- Issue date Oct 30, 2018
- Osram Opto Semiconductors GmbH
- Mathias Kaempf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating substrates and semiconductor chip
- Patent number 10,090,198
- Issue date Oct 2, 2018
- Osram Opto Semiconductors GmbH
- Mathias Kaempf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for dividing a composite into semiconductor chips, and semic...
- Patent number 9,873,166
- Issue date Jan 23, 2018
- Osram Opto Semiconductors GmbH
- Mathias Kaempf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for singulating an assemblage into semiconductor chips, and...
- Patent number 9,728,459
- Issue date Aug 8, 2017
- Osram Opto Semiconductors GmbH
- Mathias Kaempf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for singulating a component composite assembly
- Patent number 9,165,816
- Issue date Oct 20, 2015
- Osram Opto Semiconductors GmbH
- Heribert Zull
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip receptacle, method for fabricating a chip receptacle and chip...
- Patent number 7,445,119
- Issue date Nov 4, 2008
- Osram Opto Semiconductors GmbH
- Mathias Kaempf
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RADIATION-EMITTING SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A PLURA...
- Publication number 20180233627
- Publication date Aug 16, 2018
- Osram Opto Semiconductors GmbH
- Mathias KAEMPF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DIVIDING A COMPOSITE INTO SEMICONDUCTOR CHIPS, AND SEMIC...
- Publication number 20180117706
- Publication date May 3, 2018
- Osram Opto Semiconductors GmbH
- Mathias KAEMPF
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SINGULATING AN ASSEMBLAGE INTO SEMICONDUCTOR CHIPS, AND...
- Publication number 20180047628
- Publication date Feb 15, 2018
- Osram Opto Semiconductors GmbH
- Mathias KAEMPF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SEMICONDUCTOR CHIP, OPTOELECTRONIC COMPONENT AND MET...
- Publication number 20160254415
- Publication date Sep 1, 2016
- Osram Opto Semiconductors GmbH
- Mathias KAEMPF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING SUBSTRATES AND SEMICONDUCTOR CHIP
- Publication number 20160204033
- Publication date Jul 14, 2016
- Osram Opto Semiconductors GmbH
- Mathias KAEMPF
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DIVIDING A COMPOSITE INTO SEMICONDUCTOR CHIPS, AND SEMIC...
- Publication number 20160204032
- Publication date Jul 14, 2016
- Osram Opto Semiconductors GmbH
- Mathias KAEMPF
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SINGULATING AN ASSEMBLAGE INTO SEMICONDUCTOR CHIPS, AND...
- Publication number 20150303112
- Publication date Oct 22, 2015
- Osram Opto Semiconductors GmbH
- Mathias KAEMPF
- H01 - BASIC ELECTRIC ELEMENTS

Mathias KAEMPF

Person

Patents Grantslast 30 patents

Radiation-emitting semiconductor chip, method for producing a plura...

Method for dividing a composite into semiconductor chips, and semic...

Optoelectronic semiconductor chip, optoelectronic component and met...

Method for separating substrates and semiconductor chip

Method for dividing a composite into semiconductor chips, and semic...

Method for singulating an assemblage into semiconductor chips, and...

Method for singulating a component composite assembly

Chip receptacle, method for fabricating a chip receptacle and chip...

Patents Applicationslast 30 patents

RADIATION-EMITTING SEMICONDUCTOR CHIP, METHOD FOR PRODUCING A PLURA...

METHOD FOR DIVIDING A COMPOSITE INTO SEMICONDUCTOR CHIPS, AND SEMIC...

METHOD FOR SINGULATING AN ASSEMBLAGE INTO SEMICONDUCTOR CHIPS, AND...

OPTOELECTRONIC SEMICONDUCTOR CHIP, OPTOELECTRONIC COMPONENT AND MET...

METHOD FOR SEPARATING SUBSTRATES AND SEMICONDUCTOR CHIP

METHOD FOR DIVIDING A COMPOSITE INTO SEMICONDUCTOR CHIPS, AND SEMIC...

METHOD FOR SINGULATING AN ASSEMBLAGE INTO SEMICONDUCTOR CHIPS, AND...