Mathias VAUPEL

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor component and method for producing same
- Patent number 11,655,143
- Issue date May 23, 2023
- Infineon Technologies AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor module having a sensor chip and passive devices wit...
- Patent number 11,287,344
- Issue date Mar 29, 2022
- Infineon Technologies AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor component and method for producing same
- Patent number 10,947,109
- Issue date Mar 16, 2021
- Infineon Technologies AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Molded lead frame sensor package
- Patent number 10,781,095
- Issue date Sep 22, 2020
- Infineon Technologies AG
- Jochen Dangelmaier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor module having a sensor chip and passive devices wit...
- Patent number 10,677,675
- Issue date Jun 9, 2020
- Infineon Technologies AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Grant
Transducer package with integrated sealing
- Patent number 10,519,030
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Klaus Elian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor arrangement, battery cell and energy system
- Patent number 10,107,867
- Issue date Oct 23, 2018
- Infineon Technologies AG
- Klaus Elian
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pressure sensor module having a sensor chip and passive devices wit...
- Patent number 10,060,819
- Issue date Aug 28, 2018
- Infineon Technologies AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for separating semiconductor devices from a wafer
- Patent number 9,984,927
- Issue date May 29, 2018
- Infineon Technologies AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for determining a state of a rechargeable battery or of a...
- Patent number 9,748,611
- Issue date Aug 29, 2017
- Infineon Technologies AG
- Klaus Elian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor arrangement
- Patent number 9,448,130
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor package with integrated sealing
- Patent number 9,366,593
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having an identification mark
- Patent number 9,312,226
- Issue date Apr 12, 2016
- Infineon Technologies AG
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for separating semiconductor devices from a wafer
- Patent number 9,196,535
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Mathias Vaupel
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor dies having opposing sides with different reflectivity
- Patent number 9,147,639
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing process for semiconductor devices
- Patent number 9,099,547
- Issue date Aug 4, 2015
- Infineon Technologies AG
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method of manufacturing the same
- Patent number 9,013,014
- Issue date Apr 21, 2015
- Infineon Technologies AG
- Bernhard Winkler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die edge protection for pressure sensor packages
- Patent number 8,937,380
- Issue date Jan 20, 2015
- Infineon Technologies Austria AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Separation of semiconductor devices from a wafer carrier
- Patent number 8,883,565
- Issue date Nov 11, 2014
- Infineon Technologies AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,786,085
- Issue date Jul 22, 2014
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,759,207
- Issue date Jun 24, 2014
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for fabricating the same
- Patent number 8,592,999
- Issue date Nov 26, 2013
- Infineon Technologies AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device fabricated using an electroplating process
- Patent number 8,334,202
- Issue date Dec 18, 2012
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,330,274
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,148,257
- Issue date Apr 3, 2012
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,989,930
- Issue date Aug 2, 2011
- Infineon Technologies AG
- Edmund Riedl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME
- Publication number 20210087054
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Mathias VAUPEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...
- Publication number 20200370983
- Publication date Nov 26, 2020
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Application
MOLDED LEAD FRAME SENSOR PACKAGE
- Publication number 20200189908
- Publication date Jun 18, 2020
- INFINEON TECHNOLOGIES AG
- Jochen DANGELMAIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME
- Publication number 20190106321
- Publication date Apr 11, 2019
- INFINEON TECHNOLOGIES AG
- Mathias VAUPEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...
- Publication number 20180364123
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Application
Transducer package with integrated sealing
- Publication number 20170283246
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Klaus ELIAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER
- Publication number 20170117183
- Publication date Apr 27, 2017
- INFINEON TECHNOLOGIES AG
- Mathias VAUPEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...
- Publication number 20160169763
- Publication date Jun 16, 2016
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- G01 - MEASURING TESTING
Information Patent Application
SENSOR ARRANGEMENT, BATTERY CELL AND ENERGY SYSTEM
- Publication number 20150226810
- Publication date Aug 13, 2015
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Application
SENSOR ARRANGEMENT, ENERGY SYSTEM AND METHOD
- Publication number 20150132614
- Publication date May 14, 2015
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure Sensor Package with Integrated Sealing
- Publication number 20150090042
- Publication date Apr 2, 2015
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor arrangement
- Publication number 20150059454
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Mathias VAUPEL
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Dies Having Opposing Sides with Different Reflectivity
- Publication number 20150061113
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A...
- Publication number 20150004451
- Publication date Jan 1, 2015
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER
- Publication number 20140367015
- Publication date Dec 18, 2014
- Mathias VAUPEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140319627
- Publication date Oct 30, 2014
- INFINEON TECHNOLOGIES AG
- Bernhard Winkler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device Having an Identification Mark
- Publication number 20140167272
- Publication date Jun 19, 2014
- INFINEON TECHNOLOGIES AG
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20130309864
- Publication date Nov 21, 2013
- Infineon Technologies AG
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separation of Semiconductor Devices from a Wafer Carrier
- Publication number 20130084658
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Testing Process for Semiconductor Devices
- Publication number 20130084659
- Publication date Apr 4, 2013
- INFINEON TECHNOLOGIES AG
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20130062770
- Publication date Mar 14, 2013
- Infineon Technologies AG
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip and Method for Fabricating the Same
- Publication number 20120181710
- Publication date Jul 19, 2012
- Mathias Vaupel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120080791
- Publication date Apr 5, 2012
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120074574
- Publication date Mar 29, 2012
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FABRICATED USING AN ELECTROPLATING PROCESS
- Publication number 20110101532
- Publication date May 5, 2011
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20090108423
- Publication date Apr 30, 2009
- INFINEON TECHNOLOGIES AG
- Edmund Riedl
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Mathias VAUPEL

Person

Patents Grantslast 30 patents

Semiconductor component and method for producing same

Pressure sensor module having a sensor chip and passive devices wit...

Semiconductor component and method for producing same

Molded lead frame sensor package

Pressure sensor module having a sensor chip and passive devices wit...

Transducer package with integrated sealing

Sensor arrangement, battery cell and energy system

Pressure sensor module having a sensor chip and passive devices wit...

Method and apparatus for separating semiconductor devices from a wafer

Apparatus for determining a state of a rechargeable battery or of a...

Sensor arrangement

Pressure sensor package with integrated sealing

Semiconductor device having an identification mark

Method and apparatus for separating semiconductor devices from a wafer

Semiconductor dies having opposing sides with different reflectivity

Testing process for semiconductor devices

Chip package and a method of manufacturing the same

Die edge protection for pressure sensor packages

Separation of semiconductor devices from a wafer carrier

Semiconductor structure and method for making same

Semiconductor structure and method for making same

Semiconductor chip and method for fabricating the same

Device fabricated using an electroplating process

Semiconductor structure and method for making same

Semiconductor structure and method for making same

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME

PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...

MOLDED LEAD FRAME SENSOR PACKAGE

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME

PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...

Transducer package with integrated sealing

METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER

PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WIT...

SENSOR ARRANGEMENT, BATTERY CELL AND ENERGY SYSTEM

SENSOR ARRANGEMENT, ENERGY SYSTEM AND METHOD

Pressure Sensor Package with Integrated Sealing

Sensor arrangement

Semiconductor Dies Having Opposing Sides with Different Reflectivity

APPARATUS FOR DETERMINING A STATE OF A RECHARGEABLE BATTERY OR OF A...

METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER

CHIP PACKAGE AND A METHOD OF MANUFACTURING THE SAME

Semiconductor Device Having an Identification Mark

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

Separation of Semiconductor Devices from a Wafer Carrier

Testing Process for Semiconductor Devices

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

Semiconductor Chip and Method for Fabricating the Same

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

DEVICE FABRICATED USING AN ELECTROPLATING PROCESS

SEMICONDUCTOR PACKAGE