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Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
Grinding apparatus
Patent number
11,967,506
Issue date
Apr 23, 2024
Disco Corporation
Mato Hattori
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
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Patent Application
WAFER PROCESSING APPARATUS
Publication number
20240194501
Publication date
Jun 13, 2024
Disco Corporation
Kentaro IIZUKA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Application
GRINDING METHOD OF WORKPIECE
Publication number
20240165766
Publication date
May 23, 2024
Disco Corporation
Mato HATTORI
B24 - GRINDING POLISHING
Information
Patent Application
GRINDING APPARATUS
Publication number
20220262641
Publication date
Aug 18, 2022
Disco Corporation
Mato HATTORI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING APPARATUS
Publication number
20220048152
Publication date
Feb 17, 2022
Disco Corporation
Mato HATTORI
B24 - GRINDING POLISHING