Matsuda Tsukasa

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming wiring structures including a plurality of metal...
- Patent number 9,773,699
- Issue date Sep 26, 2017
- Samsung Electronics Co., Ltd.
- Jong-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabricating method thereof
- Patent number 9,276,116
- Issue date Mar 1, 2016
- Samsung Elecronics Co., Ltd.
- Shigenobu Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices including capped met...
- Patent number 9,171,755
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Euibok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal patterns in openings in semiconductor devices
- Patent number 8,258,058
- Issue date Sep 4, 2012
- Samsung Electronic Co., Ltd.
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal patterns in openings in semiconductor devices
- Patent number 8,148,261
- Issue date Apr 3, 2012
- Samsung Electronics Co., Ltd.
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING WIRING STRUCTURES
- Publication number 20160293484
- Publication date Oct 6, 2016
- Jong-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRING STRUCTURES IN A SEMICONDUCTOR DEVICE
- Publication number 20160276267
- Publication date Sep 22, 2016
- Jong-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Fabricating Method Thereof
- Publication number 20160155816
- Publication date Jun 2, 2016
- Shigenobu Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160141246
- Publication date May 19, 2016
- Jin-Nam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20150115398
- Publication date Apr 30, 2015
- Samsung Electronics Co., Ltd.
- Euibok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Fabricating Method Thereof
- Publication number 20140203370
- Publication date Jul 24, 2014
- Shigenobu Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20140080302
- Publication date Mar 20, 2014
- Samsung Electronics Co., Ltd.
- Tsukasa MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING THROUGH SILICON VIA STRUCTURES HA...
- Publication number 20130020719
- Publication date Jan 24, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Eun-Ji Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Metal Patterns in Openings in Semiconductor Devices
- Publication number 20120164826
- Publication date Jun 28, 2012
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Metal Patterns in Openings in Semiconductor Devices
- Publication number 20100227473
- Publication date Sep 9, 2010
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming metallization in a semiconductor device using sel...
- Publication number 20100068881
- Publication date Mar 18, 2010
- Joo-ho Kang
- H01 - BASIC ELECTRIC ELEMENTS

Matsuda Tsukasa

Person

Patents Grantslast 30 patents

Methods of forming wiring structures including a plurality of metal...

Semiconductor device and fabricating method thereof

Methods of manufacturing semiconductor devices including capped met...

Methods of forming metal patterns in openings in semiconductor devices

Methods of forming metal patterns in openings in semiconductor devices

Patents Applicationslast 30 patents

METHODS OF FORMING WIRING STRUCTURES

METHODS OF FORMING WIRING STRUCTURES IN A SEMICONDUCTOR DEVICE

Semiconductor Device and Fabricating Method Thereof

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

Semiconductor Device and Fabricating Method Thereof

METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICES INCLUDING THROUGH SILICON VIA STRUCTURES HA...

Methods of Forming Metal Patterns in Openings in Semiconductor Devices

Methods of Forming Metal Patterns in Openings in Semiconductor Devices

Method of forming metallization in a semiconductor device using sel...