Matthew A. Ring

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Saco, ME, US

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Patents Grantslast 30 patents

Information Patent Grant
Structure and method for post oxidation silicon trench bottom shaping
- Patent number 8,624,302
- Issue date Jan 7, 2014
- Fairchild Semiconductor Corporation
- Matthew A. Ring
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RELIABLE SOLDER BUMP COUPLING WITHIN A CHIP SCALE PACKAGE
- Publication number 20120248599
- Publication date Oct 4, 2012
- Matthew A. Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE
- Publication number 20110266670
- Publication date Nov 3, 2011
- Luke England
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTINUOUS ASYMMETRICALLY SLOPED SHALLOW TRENCH ISOLATION REGION
- Publication number 20110248341
- Publication date Oct 13, 2011
- Matthew Alan Ring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Post Oxidation Silicon Trench Bottom Shaping
- Publication number 20110193142
- Publication date Aug 11, 2011
- Matthew A. Ring
- H01 - BASIC ELECTRIC ELEMENTS