Matthew Baron

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Albany, NY, US

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Patents Applicationslast 30 patents

Information Patent Application
METHOD OF SURFACE MODIFICATION FOR WAFER BONDING
- Publication number 20250087628
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PROTECTING TO REUSE SILICON CARRIER WAFER BASED ON IR L...
- Publication number 20250079166
- Publication date Mar 6, 2025
- TOKYO ELECTRON LIMITED
- Panupong JAIPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
- Publication number 20240363564
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING ISOLATION STRUCTURES USING DIRECTIONAL BEAM...
- Publication number 20240145312
- Publication date May 2, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS