Matthew David Romig

Person

Wylie, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package for isolation dies
- Patent number 12,243,911
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module leadless package
- Patent number 12,142,550
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods, apparatus, and systems to facilitate multi-channel isolation
- Patent number 11,669,069
- Issue date Jun 6, 2023
- Texas Instruments Incorporated
- Matthew David Romig
- G05 - CONTROLLING REGULATING
Information Patent Grant
Multi-chip module leadless package
- Patent number 11,538,741
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermistor die-based thermal probe
- Patent number 11,525,739
- Issue date Dec 13, 2022
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-printed protective shell structures with support columns for str...
- Patent number 11,082,028
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods, apparatus, and systems to facilitate multi-channel isolation
- Patent number 11,061,384
- Issue date Jul 13, 2021
- Texas Instruments Incorporated
- Matthew David Romig
- G05 - CONTROLLING REGULATING
Information Patent Grant
Bond wire support systems and methods
- Patent number 11,049,836
- Issue date Jun 29, 2021
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor system having unidirectional connections to...
- Patent number 10,756,013
- Issue date Aug 25, 2020
- Texas Instruments Incorporated
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor system having unidirectional connections to...
- Patent number 10,566,276
- Issue date Feb 18, 2020
- Texas Instruments Incorporated
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-printed protective shell structures for stress sensitive circuits
- Patent number 10,516,381
- Issue date Dec 24, 2019
- Texas Instruments Incorporated
- James Cooper Wainerdi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Discrete device mounted on substrate
- Patent number 9,899,339
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive through-polymer vias for capacitative structures integra...
- Patent number 9,852,979
- Issue date Dec 26, 2017
- Texas Instruments Incorporated
- Matthew D. Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die power converter
- Patent number 9,842,797
- Issue date Dec 12, 2017
- Texas Instruments Incorporated
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device with additive substrate surface modification
- Patent number 9,780,017
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated power package
- Patent number 9,768,130
- Issue date Sep 19, 2017
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed interconnects for semiconductor packages
- Patent number 9,679,864
- Issue date Jun 13, 2017
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated molded package with embedded antenna for high data rat...
- Patent number 9,647,329
- Issue date May 9, 2017
- Texas Instruments Incorporated
- Juan Alejandro Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive through-polymer vias for capacitative structures integra...
- Patent number 9,572,261
- Issue date Feb 14, 2017
- Texas Instruments Incorporated
- Matthew D. Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package and method
- Patent number 9,527,728
- Issue date Dec 27, 2016
- Texas Instruments Incorporated
- Matthew David Romig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with additive substrate surface modification
- Patent number 9,524,926
- Issue date Dec 20, 2016
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed interconnects for semiconductor packages
- Patent number 9,496,171
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with printed circuit layer
- Patent number 9,111,845
- Issue date Aug 18, 2015
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with three dimensional inkjet printed traces
- Patent number 8,945,986
- Issue date Feb 3, 2015
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package with printed circuit layer
- Patent number 8,847,349
- Issue date Sep 30, 2014
- Texas Instruments Incorporated
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly with three dimensional inkjet printed traces
- Patent number 8,816,513
- Issue date Aug 26, 2014
- Texas Instruments Incorporated
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for high-speed signal integrity in semiconductor package...
- Patent number 8,723,337
- Issue date May 13, 2014
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting agglomerate terminals of semiconductor packages
- Patent number 8,716,068
- Issue date May 6, 2014
- Texas Instruments Incorporated
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having agglomerate terminals
- Patent number 8,643,165
- Issue date Feb 4, 2014
- Texas Instruments Incorporated
- Darvin R. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for uniform current distribution in power supp...
- Patent number 8,299,588
- Issue date Oct 30, 2012
- Texas Instruments Incorporated
- Tetsuo Tateishi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP MODULE LEADLESS PACKAGE
- Publication number 20250022781
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE LEADLESS PACKAGE
- Publication number 20230129232
- Publication date Apr 27, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, APPARATUS, AND SYSTEMS TO FACILITATE MULTI-CHANNEL ISOLATION
- Publication number 20210294302
- Publication date Sep 23, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- G05 - CONTROLLING REGULATING
Information Patent Application
MULTI-CHIP MODULE LEADLESS PACKAGE
- Publication number 20210257282
- Publication date Aug 19, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package for Isolation Dies
- Publication number 20210175326
- Publication date Jun 10, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, APPARATUS, AND SYSTEMS TO FACILITATE MULTI-CHANNEL ISOLATION
- Publication number 20210157299
- Publication date May 27, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- G05 - CONTROLLING REGULATING
Information Patent Application
PACKAGED SEMICONDUCTOR SYSTEM HAVING UNIDIRECTIONAL CONNECTIONS TO...
- Publication number 20200185323
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTING OF PROTECTIVE SHELL STRUCTURES FOR STRESS SENSITIVE CIR...
- Publication number 20200127637
- Publication date Apr 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- James Cooper WAINERDI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMISTOR DIE-BASED THERMAL PROBE
- Publication number 20190346312
- Publication date Nov 14, 2019
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW DAVID ROMIG
- G01 - MEASURING TESTING
Information Patent Application
BOND WIRE SUPPORT SYSTEMS AND METHODS
- Publication number 20190326247
- Publication date Oct 24, 2019
- TEXAS INSTRUMENTS INCORPORATED
- MATTHEW DAVID ROMIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTING OF PROTECTIVE SHELL STRUCTURES FOR STRESS SENSITIVE CIR...
- Publication number 20190207582
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- James Cooper WAINERDI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED SEMICONDUCTOR SYSTEM HAVING UNIDIRECTIONAL CONNECTIONS TO...
- Publication number 20190139883
- Publication date May 9, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY ANTENNA STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND...
- Publication number 20170347490
- Publication date Nov 30, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED POWER PACKAGE
- Publication number 20170117238
- Publication date Apr 27, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Device with Additive Substrate Surface Modification
- Publication number 20170053854
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Through-Polymer Vias for Capacitative Structures Integra...
- Publication number 20170047283
- Publication date Feb 16, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Matthew D. Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES
- Publication number 20170033072
- Publication date Feb 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Through-Polymer Vias for Capacitative Structures Integra...
- Publication number 20160286654
- Publication date Sep 29, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Matthew D. Romig
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE METHOD
- Publication number 20160096727
- Publication date Apr 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED DEVICE WITH ADDITIVE SUBSTRATE SURFACE MODIFICATION
- Publication number 20160093558
- Publication date Mar 31, 2016
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES
- Publication number 20160093525
- Publication date Mar 31, 2016
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Molded Package with Embedded Antenna for High Data Rat...
- Publication number 20150295305
- Publication date Oct 15, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Juan Alejandro Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20150021721
- Publication date Jan 22, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER
- Publication number 20140361402
- Publication date Dec 11, 2014
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER
- Publication number 20140175599
- Publication date Jun 26, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION
- Publication number 20140179064
- Publication date Jun 26, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew D. Romig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic Assembly with Three Dimensional Inkjet Printed Traces
- Publication number 20140127856
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE MOUNTED ON SUBSTRATE
- Publication number 20140124939
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE POWER CONVERTER
- Publication number 20140061884
- Publication date Mar 6, 2014
- Brian A. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly With Three Dimensional Inkjet Printed Traces
- Publication number 20140054795
- Publication date Feb 27, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS

Matthew David Romig

Person

Patents Grantslast 30 patents

Integrated circuit package for isolation dies

Multi-chip module leadless package

Methods, apparatus, and systems to facilitate multi-channel isolation

Multi-chip module leadless package

Thermistor die-based thermal probe

3D-printed protective shell structures with support columns for str...

Methods, apparatus, and systems to facilitate multi-channel isolation

Bond wire support systems and methods

Packaged semiconductor system having unidirectional connections to...

Packaged semiconductor system having unidirectional connections to...

3D-printed protective shell structures for stress sensitive circuits

Discrete device mounted on substrate

Conductive through-polymer vias for capacitative structures integra...

Stacked die power converter

Packaged device with additive substrate surface modification

Integrated power package

Printed interconnects for semiconductor packages

Encapsulated molded package with embedded antenna for high data rat...

Conductive through-polymer vias for capacitative structures integra...

Integrated circuit package and method

Packaged device with additive substrate surface modification

Printed interconnects for semiconductor packages

Integrated circuit package with printed circuit layer

Electronic assembly with three dimensional inkjet printed traces

Integrated circuit package with printed circuit layer

Electronic assembly with three dimensional inkjet printed traces

Structure for high-speed signal integrity in semiconductor package...

Method for contacting agglomerate terminals of semiconductor packages

Semiconductor device having agglomerate terminals

Structure and method for uniform current distribution in power supp...

Patents Applicationslast 30 patents

MULTI-CHIP MODULE LEADLESS PACKAGE

MULTI-CHIP MODULE LEADLESS PACKAGE

METHODS, APPARATUS, AND SYSTEMS TO FACILITATE MULTI-CHANNEL ISOLATION

MULTI-CHIP MODULE LEADLESS PACKAGE

Integrated Circuit Package for Isolation Dies

METHODS, APPARATUS, AND SYSTEMS TO FACILITATE MULTI-CHANNEL ISOLATION

PACKAGED SEMICONDUCTOR SYSTEM HAVING UNIDIRECTIONAL CONNECTIONS TO...

3D PRINTING OF PROTECTIVE SHELL STRUCTURES FOR STRESS SENSITIVE CIR...

THERMISTOR DIE-BASED THERMAL PROBE

BOND WIRE SUPPORT SYSTEMS AND METHODS

3D PRINTING OF PROTECTIVE SHELL STRUCTURES FOR STRESS SENSITIVE CIR...

PACKAGED SEMICONDUCTOR SYSTEM HAVING UNIDIRECTIONAL CONNECTIONS TO...

HIGH-FREQUENCY ANTENNA STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND...

INTEGRATED POWER PACKAGE

Packaged Device with Additive Substrate Surface Modification

Conductive Through-Polymer Vias for Capacitative Structures Integra...

PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES

Conductive Through-Polymer Vias for Capacitative Structures Integra...

INTEGRATED CIRCUIT PACKAGE METHOD

PACKAGED DEVICE WITH ADDITIVE SUBSTRATE SURFACE MODIFICATION

PRINTED INTERCONNECTS FOR SEMICONDUCTOR PACKAGES

Encapsulated Molded Package with Embedded Antenna for High Data Rat...

INTEGRATED CIRCUIT PACKAGE AND METHOD

INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER

INTEGRATED CIRCUIT PACKAGE WITH PRINTED CIRCUIT LAYER

METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION

Electronic Assembly with Three Dimensional Inkjet Printed Traces

DISCRETE DEVICE MOUNTED ON SUBSTRATE

STACKED DIE POWER CONVERTER

Electronic Assembly With Three Dimensional Inkjet Printed Traces