Matthew E. Colburn

Person

Schenectady, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 12,106,963
- Issue date Oct 1, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 11,670,510
- Issue date Jun 6, 2023
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 11,018,007
- Issue date May 25, 2021
- Tessera, Inc.
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned quadruple patterning (SAQP) for routing layouts includ...
- Patent number 10,957,583
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned quadruple patterning (SAQP) for routing layouts includ...
- Patent number 10,546,774
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 10,529,569
- Issue date Jan 7, 2020
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned conductive lines with relaxed overlay
- Patent number 10,395,985
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 10,121,661
- Issue date Nov 6, 2018
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned conductive lines with relaxed overlay
- Patent number 10,083,864
- Issue date Sep 25, 2018
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned quadruple patterning (SAQP) for routing layouts includ...
- Patent number 9,991,156
- Issue date Jun 5, 2018
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning conductive vias with trenches
- Patent number 9,972,533
- Issue date May 15, 2018
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned pattern formation post spacer etchback in tight pitch...
- Patent number 9,934,970
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned conductive lines
- Patent number 9,852,946
- Issue date Dec 26, 2017
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned quadruple patterning process
- Patent number 9,842,737
- Issue date Dec 12, 2017
- International Business Machines Corporation
- Matthew E. Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for cut material selection
- Patent number 9,779,944
- Issue date Oct 3, 2017
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning conductive vias with trenches
- Patent number 9,773,700
- Issue date Sep 26, 2017
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphoepitaxy directed self-assembly process for semiconductor fin...
- Patent number 9,659,824
- Issue date May 23, 2017
- International Business Machines Corporation
- Joy Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned conductive lines with relaxed overlay
- Patent number 9,607,886
- Issue date Mar 28, 2017
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin trimming in a double sit process
- Patent number 9,601,345
- Issue date Mar 21, 2017
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to harden photoresist for directed self-assembly processes
- Patent number 9,563,122
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Joy Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Integration of dense and variable pitch fin structures
- Patent number 9,378,972
- Issue date Jun 28, 2016
- GLOBALFOUNDRIES Inc.
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned quadruple patterning process
- Patent number 9,305,845
- Issue date Apr 5, 2016
- International Business Machines Corporation
- Matthew E. Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grapho-epitaxy DSA process with dimension control of template pattern
- Patent number 9,123,658
- Issue date Sep 1, 2015
- International Business Machines Corporation
- Jassem A. Abdallah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of dense and variable pitch fin structures
- Patent number 9,087,792
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of multiple exposures with spin castable films
- Patent number 9,058,997
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Martin Burkhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of dense and variable pitch fin structures
- Patent number 9,040,371
- Issue date May 26, 2015
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming nanoparticles using semiconductor manufacturing...
- Patent number 8,986,596
- Issue date Mar 24, 2015
- International Business Machines Corporation
- Joy Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnect structures with engineered dielectrics with nanocolumn...
- Patent number 8,901,741
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Matthew E. Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall image transfer process
- Patent number 8,883,649
- Issue date Nov 11, 2014
- International Business Machines Corporation
- Yunpeng Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DSA grapho-epitaxy process with etch stop material
- Patent number 8,859,433
- Issue date Oct 14, 2014
- International Business Machines Corporation
- Jassem A. Abdallah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20240096627
- Publication date Mar 21, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20210280422
- Publication date Sep 9, 2021
- Tessera, Inc.
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20200075336
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED QUADRUPLE PATTERNING (SAQP) FOR ROUTING LAYOUTS INCLUD...
- Publication number 20190393082
- Publication date Dec 26, 2019
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20180350599
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED CONDUCTIVE LINES WITH RELAXED OVERLAY
- Publication number 20180233408
- Publication date Aug 16, 2018
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED QUADRUPLE PATTERNING (SAQP) FOR ROUTING LAYOUTS INCLUD...
- Publication number 20180233403
- Publication date Aug 16, 2018
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20180197738
- Publication date Jul 12, 2018
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNING CONDUCTIVE VIAS WITH TRENCHES
- Publication number 20180025943
- Publication date Jan 25, 2018
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED CONDUCTIVE LINES WITH RELAXED OVERLAY
- Publication number 20180005885
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED CONDUCTIVE LINES
- Publication number 20170358492
- Publication date Dec 14, 2017
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED QUADRUPLE PATTERNING (SAQP) FOR ROUTING LAYOUTS INCLUD...
- Publication number 20170352585
- Publication date Dec 7, 2017
- International Business Machines Corporation
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHOEPITAXY DIRECTED SELF-ASSEMBLY PROCESS FOR SEMICONDUCTOR FIN...
- Publication number 20160322259
- Publication date Nov 3, 2016
- International Business Machines Corporation
- Joy Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO HARDEN PHOTORESIST FOR DIRECTED SELF-ASSEMBLY PROCESSES
- Publication number 20160320701
- Publication date Nov 3, 2016
- International Business Machines Corporation
- Joy Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN TRIMMING IN A DOUBLE SIT PROCESS
- Publication number 20160284558
- Publication date Sep 29, 2016
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED QUADRUPLE PATTERNING PROCESS
- Publication number 20160163600
- Publication date Jun 9, 2016
- International Business Machines Corporation
- Matthew E. COLBURN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED QUADRUPLE PATTERNING PROCESS
- Publication number 20160071771
- Publication date Mar 10, 2016
- International Business Machines Corporation
- Matthew E. COLBURN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF DENSE AND VARIABLE PITCH FIN STRUCTURES
- Publication number 20150170927
- Publication date Jun 18, 2015
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF DENSE AND VARIABLE PITCH FIN STRUCTURES
- Publication number 20150041812
- Publication date Feb 12, 2015
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF DENSE AND VARIABLE PITCH FIN STRUCTURES
- Publication number 20150041958
- Publication date Feb 12, 2015
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHO-EPITAXY DSA PROCESS WITH DIMENSION CONTROL OF TEMPLATE PATTERN
- Publication number 20140322917
- Publication date Oct 30, 2014
- Jassem A. Abdallah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHO-EPITAXY DSA PROCESS WITH DIMENSION CONTROL OF TEMPLATE PATTERN
- Publication number 20140315390
- Publication date Oct 23, 2014
- International Business Machines Corporation
- JASSEM A. ABDALLAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DSA GRAPHO-EPITAXY PROCESS WITH ETCH STOP MATERIAL
- Publication number 20140256145
- Publication date Sep 11, 2014
- International Business Machines Corporation
- JASSEM A. ABDALLAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING NANOPARTICLES USING SEMICONDUCTOR MANUFACTURING...
- Publication number 20140138863
- Publication date May 22, 2014
- International Business Machines Corporation
- Joy Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIMULTANEOUS PHOTORESIST DEVELOPMENT AND NEUTRAL POLYMER LAYER FORM...
- Publication number 20140099583
- Publication date Apr 10, 2014
- International Business Machines Corporation
- Steven J. Holmes
- B82 - NANO-TECHNOLOGY
Information Patent Application
WAFER FILL PATTERNS AND USES
- Publication number 20130181267
- Publication date Jul 18, 2013
- International Business Machines Corporation
- Martin Burkhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TONE INVERSION WITH PARTIAL UNDERLAYER ETCH FOR SEMICONDUCTOR DEVIC...
- Publication number 20130175658
- Publication date Jul 11, 2013
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating dual damascene structures using a multilevel...
- Publication number 20130026639
- Publication date Jan 31, 2013
- International Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH ENGINEERED DIELECTRICS WITH NANOCOLUMN...
- Publication number 20130009315
- Publication date Jan 10, 2013
- Matthew E. Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PNEUMATIC METHOD AND APPARATUS FOR NANO IMPRINT LITHOGRAPHY HAVING...
- Publication number 20120321740
- Publication date Dec 20, 2012
- International Business Machines Corporation
- Matthew E. Colburn
- B82 - NANO-TECHNOLOGY

Matthew E. Colburn

Person

Patents Grantslast 30 patents

Self aligned pattern formation post spacer etchback in tight pitch...

Self aligned pattern formation post spacer etchback in tight pitch...

Self aligned pattern formation post spacer etchback in tight pitch...

Self-aligned quadruple patterning (SAQP) for routing layouts includ...

Self-aligned quadruple patterning (SAQP) for routing layouts includ...

Self aligned pattern formation post spacer etchback in tight pitch...

Self aligned conductive lines with relaxed overlay

Self aligned pattern formation post spacer etchback in tight pitch...

Self aligned conductive lines with relaxed overlay

Self-aligned quadruple patterning (SAQP) for routing layouts includ...

Aligning conductive vias with trenches

Self aligned pattern formation post spacer etchback in tight pitch...

Self aligned conductive lines

Self-aligned quadruple patterning process

Method and structure for cut material selection

Aligning conductive vias with trenches

Graphoepitaxy directed self-assembly process for semiconductor fin...

Self aligned conductive lines with relaxed overlay

Fin trimming in a double sit process

Method to harden photoresist for directed self-assembly processes

Integration of dense and variable pitch fin structures

Self-aligned quadruple patterning process

Grapho-epitaxy DSA process with dimension control of template pattern

Integration of dense and variable pitch fin structures

Process of multiple exposures with spin castable films

Integration of dense and variable pitch fin structures

Methods of forming nanoparticles using semiconductor manufacturing...

Interconnect structures with engineered dielectrics with nanocolumn...

Sidewall image transfer process

DSA grapho-epitaxy process with etch stop material

Patents Applicationslast 30 patents

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

SELF-ALIGNED QUADRUPLE PATTERNING (SAQP) FOR ROUTING LAYOUTS INCLUD...

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

SELF ALIGNED CONDUCTIVE LINES WITH RELAXED OVERLAY

SELF-ALIGNED QUADRUPLE PATTERNING (SAQP) FOR ROUTING LAYOUTS INCLUD...

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

ALIGNING CONDUCTIVE VIAS WITH TRENCHES

SELF ALIGNED CONDUCTIVE LINES WITH RELAXED OVERLAY

SELF ALIGNED CONDUCTIVE LINES

SELF-ALIGNED QUADRUPLE PATTERNING (SAQP) FOR ROUTING LAYOUTS INCLUD...

GRAPHOEPITAXY DIRECTED SELF-ASSEMBLY PROCESS FOR SEMICONDUCTOR FIN...

METHOD TO HARDEN PHOTORESIST FOR DIRECTED SELF-ASSEMBLY PROCESSES

FIN TRIMMING IN A DOUBLE SIT PROCESS

SELF-ALIGNED QUADRUPLE PATTERNING PROCESS

SELF-ALIGNED QUADRUPLE PATTERNING PROCESS

INTEGRATION OF DENSE AND VARIABLE PITCH FIN STRUCTURES

INTEGRATION OF DENSE AND VARIABLE PITCH FIN STRUCTURES

INTEGRATION OF DENSE AND VARIABLE PITCH FIN STRUCTURES

GRAPHO-EPITAXY DSA PROCESS WITH DIMENSION CONTROL OF TEMPLATE PATTERN

GRAPHO-EPITAXY DSA PROCESS WITH DIMENSION CONTROL OF TEMPLATE PATTERN

DSA GRAPHO-EPITAXY PROCESS WITH ETCH STOP MATERIAL

METHODS OF FORMING NANOPARTICLES USING SEMICONDUCTOR MANUFACTURING...

SIMULTANEOUS PHOTORESIST DEVELOPMENT AND NEUTRAL POLYMER LAYER FORM...

WAFER FILL PATTERNS AND USES

TONE INVERSION WITH PARTIAL UNDERLAYER ETCH FOR SEMICONDUCTOR DEVIC...

Method of fabricating dual damascene structures using a multilevel...

INTERCONNECT STRUCTURES WITH ENGINEERED DIELECTRICS WITH NANOCOLUMN...

PNEUMATIC METHOD AND APPARATUS FOR NANO IMPRINT LITHOGRAPHY HAVING...